Memory IC S29GL128S10DHIV23 product image

S29GL128S10DHIV23

$3.43
  • Description:IC FLASH 128MBIT PARALLEL 64FBGA
  • Series:GL-S
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)

SKU:a08c6c87545b Category: Brand:

  
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S29GL128S10DHIV23 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 128MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S29GL128S10DHIV23

  • Description:IC FLASH 128MBIT PARALLEL 64FBGA
  • Series:GL-S
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:128Mbit
  • Memory Organization:8M x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:60ns
  • Voltage - Supply:1.65V ~ 3.6V
  • Operating Temperature:-40°C ~ 85°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LBGA
  • Supplier Device Package:64-FBGA (9x9)
  • Access Time:100 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S29GL128S10DHIV23

S29GL128S10DHIV23

Memory IC Overview

The S29GL128S10DHIV23 is a 128 Mbit parallel NOR flash memory from Infineon's GL-S family, utilizing 65 nm MIRRORBIT Eclipse technology. It features a 16-bit data bus and operates on a single 2.7 V to 3.6 V supply. The device provides a random access time of 100 ns and a page access time of 15 ns. It includes a 512-byte write buffer for efficient programming and supports asynchronous reads with Versatile I/O capabilities ranging from 1.65 V to VCC.

Memory IC Feature Summary

  • Supports execute-in-place (XIP) operations with fast random access times suitable for code execution directly from the memory.
  • Integrates an internal hardware automatic error checking and correction (ECC) mechanism to correct single-bit errors during read operations.
  • Features advanced sector protection (ASP) providing both volatile and non-volatile methods to secure individual sectors against unauthorized program or erase actions.

Memory IC Applications

  • Embedded systems requiring high-density non-volatile storage with direct code execution capabilities
  • Industrial applications demanding robust data integrity through hardware ECC support
  • Automotive electronics requiring AEC-Q100 qualified components for critical system functions

Memory IC Procurement Notes

Verify the specific ordering suffix to confirm package type, temperature grade, and lead-free status. Ensure compatibility with host system voltage levels, particularly regarding the Versatile I/O range. Confirm that the required industrial or automotive qualification grades match the application environment specifications before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 128 Mbit capacity with a 16-bit interface is required for parallel architecture designs. Consider the 100 ns access speed and 512-byte buffer for performance optimization in embedded environments. Evaluate the need for advanced sector protection and ECC features if data reliability is critical for the target application scenario.

Memory IC Part Context

This part belongs to the S29GL128S series within the broader GL-S family of 3.0 V core flash memories. The series encompasses densities from 128 Mb to 1 Gb, all sharing similar command sets and architectural features like the MIRRORBIT Eclipse process. The 'V' suffix typically denotes specific packaging or temperature variations within the standard industrial or automotive product lines.

Memory IC Replacement Considerations

Direct replacements must maintain the 128 Mbit density, 16-bit parallel interface, and compatible pinout. Verify that alternative parts support the same 100 ns access time and 512-byte buffer size. Ensure any substitute meets the required industrial or automotive temperature ranges and holds equivalent AEC-Q100 qualifications if applicable.

S29GL128S10DHIV23S29GL128S10DHIV23
$3.43
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