Memory IC S29GL512S11FHB023 product image

S29GL512S11FHB023

$8.64
  • Description:IC FLASH 512MBIT PARALLEL 64FBGA
  • Series:GL-S
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)

SKU:a74d3fea1051 Category: Brand:

  
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S29GL512S11FHB023 is listed in the Memory IC range at ChipApex. The manufacturer field lists Infineon Technologies. Its product description is IC FLASH 512MBIT PARALLEL 64FBGA. Review the specifications below when checking this part for your BOM.

Memory IC specifications for S29GL512S11FHB023

  • Description:IC FLASH 512MBIT PARALLEL 64FBGA
  • Series:GL-S
  • Mfr:Infineon Technologies
  • Package:Tape & Reel (TR)
  • Memory Type:Non-Volatile
  • Memory Format:FLASH
  • Technology:FLASH - NOR
  • Memory Size:512Mbit
  • Memory Organization:32M x 16
  • Memory Interface:Parallel
  • Clock Frequency:-
  • Write Cycle Time - Word, Page:60ns
  • Voltage - Supply:2.7V ~ 3.6V
  • Operating Temperature:-40°C ~ 105°C (TA)
  • Mounting Type:Surface Mount
  • Package / Case:64-LBGA
  • Supplier Device Package:64-FBGA (11x13)
  • Access Time:110 ns
  • Grade:-
  • Qualification:-

Memory IC datasheet and documents for S29GL512S11FHB023

S29GL512S11FHB023

Memory IC Overview

The S29GL512S11FHB023 is a 512-Mbit (64 M x 16) parallel NOR flash memory from the GL-S family, fabricated on 65-nm MirrorBit Eclipse technology. It operates with a single 3.0 V core supply (2.7 V to 3.6 V) and features versatile I/O supporting 1.65 V to VCC levels. The device provides asynchronous random access times of 110 ns and page access times of 25 ns. It includes a 512-byte write buffer for efficient programming, automatic hardware ECC for single-bit error correction, and advanced sector protection. The component is housed in a 64-ball LAA Fortified BGA package.

Memory IC Feature Summary

  • Supports Versatile I/O with wide voltage range compatibility
  • Includes internal hardware ECC for data integrity
  • Features Advanced Sector Protection (ASP) methods
  • Provides suspend and resume capabilities for program/erase operations

Memory IC Applications

  • Embedded applications requiring high density and performance
  • Systems utilizing Execute-In-Place (XIP) functionality
  • Automotive electronics meeting AEC-Q100 standards

Memory IC Procurement Notes

Verify the specific ordering suffix against official Infineon documentation to confirm package type, temperature grade, and lead-free status. Ensure the selected variant matches the required industrial or automotive qualification level. Cross-reference the datasheet revision history for any updates to electrical specifications or pin configurations before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 512-Mbit capacity with a 16-bit data bus width is required. Choose this part if the design necessitates a 64-ball BGA footprint and operation within the specified voltage ranges. Consider the Versatile I/O feature if the system requires interface flexibility between different logic voltage levels.

Memory IC Part Context

This device belongs to the GL-S series of 3.0 V Parallel NOR Flash memories. The series encompasses densities ranging from 128 Mb to 1 Gb, all sharing common architectural features such as the MirrorBit Eclipse process and uniform 128-kbyte sector erase architecture. The GL-S family is designed to balance fast random access speeds with high-density data storage capabilities.

Memory IC Replacement Considerations

Consult the official Infineon replacement guide for qualified alternatives. Verify that any substitute maintains identical pinout, voltage requirements, and command set compatibility.

S29GL512S11FHB023S29GL512S11FHB023
$8.64
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