SL 10 SMD 040 8 Z SM

Headers, Male Pins Overview

The SL 10 SMD 040 8 Z SM is a surface mount board connector manufactured by Fischer Elektronik. It features a male header configuration with eight contacts arranged in a single row. The connector utilizes a 2.54 mm (0.100 inch) pitch and incorporates tin-plated contact surfaces for reliable electrical performance. Designed for direct PCB mounting, this component ensures secure interconnection in compact electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount terminal design for automated PCB assembly
• Male pin configuration with tin-plated contact surfaces
• Single row layout with 0.100 inch spacing

Headers, Male Pins Applications

• Compact electronic circuit board interconnections
• Automated pick-and-place manufacturing processes
• High-density signal routing applications

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix to confirm contact plating and packaging format. Ensure the selected variant matches the required contact count and mounting style. Cross-reference the manufacturer datasheet for precise mechanical dimensions and soldering profile recommendations before finalizing procurement orders.

Headers, Male Pins Selection Notes

Select this component when a low-profile surface mount male header is required. The tin-plated finish offers cost-effective conductivity suitable for general-purpose applications. Confirm that the single-row architecture fits within the available board space constraints and aligns with the mating connector specifications.

Headers, Male Pins Part Context

This part belongs to the SL 10 SMD series of surface mount connectors from Fischer Elektronik. The series provides various contact counts and plating options to suit different assembly needs. The SL 10 designation indicates a specific housing geometry optimized for standard PCB layouts.

Headers, Male Pins Replacement Considerations

Direct substitutes require matching the 2.54 mm pitch, 8-position count, and surface mount orientation. Verify that alternative components offer compatible tin plating and similar mechanical retention properties to ensure seamless integration without redesigning the footprint.