SL 10 SMD 104 20 G SM

Headers, Male Pins Overview

The SL 10 SMD 104 20 G SM is a surface mount male pin header manufactured by Fischer Elektronik. It features 20 positions with a 2.54 mm (0.100 inch) pitch spacing. The connector utilizes gold-plated contacts to ensure reliable signal transmission and corrosion resistance. Designed for PCB mounting, this component belongs to the SL 10 SMD 104 series, offering a compact profile suitable for space-constrained electronic assemblies.

Headers, Male Pins Feature Summary

• Surface mount design for automated PCB assembly
• Gold-plated contact surfaces for enhanced conductivity
• Standard 2.54 mm pitch spacing compatibility

Headers, Male Pins Applications

• General purpose electronic circuit interconnections
• Compact consumer device PCB assemblies
• Industrial control board signal routing

Headers, Male Pins Procurement Notes

Verify the specific ordering suffix against the manufacturer's official datasheet to confirm contact plating thickness and material specifications. Ensure the selected variant matches the required current rating and voltage classification for the target application environment. Cross-reference the part number with authorized distributor catalogs to confirm availability of the exact configuration.

Headers, Male Pins Selection Notes

Select this component based on the requirement for a 20-position surface mount interface with standard 2.54 mm spacing. Consider the gold plating option when long-term reliability in corrosive environments or frequent mating cycles is necessary. Evaluate the mechanical footprint constraints to ensure the SMD form factor fits within the designated PCB area without interfering with adjacent components.

Headers, Male Pins Part Context

This part belongs to the Fischer Elektronik SL 10 SMD 104 series, which provides a range of male headers for surface mount technology. The series offers various contact counts and plating options to suit different density and performance requirements. These connectors are engineered for high-volume manufacturing processes, ensuring consistent placement accuracy and robust mechanical retention on printed circuit boards.