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SN74BCT29828BNT is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is BUS TRANSCEIVER. Review the specifications below when checking this part for your BOM.
The SN74BCT29828BNT is a 10-bit bus transceiver manufactured by Texas Instruments, belonging to the BCT logic series. It features 3-state outputs and operates within a supply voltage range of 4.5 V to 5.5 V. The device utilizes an SOIC-20 package for surface-mount installation. Key electrical parameters include a propagation delay of 7.3 ns at 5 V, with high-level output current of -24 mA and low-level output current of 48 mA. It supports non-inverting functionality across its ten channels.
Verify the specific suffix 'BNT' against official Texas Instruments documentation to confirm tape-and-reel packaging and orientation markings. Ensure the component matches the required SOIC-20 footprint and pin configuration for your PCB layout. Cross-reference the datasheet revision date to validate electrical specifications and thermal performance data before integration into production designs.
Select this component when designing systems requiring bidirectional data flow between buses or memory interfaces. The BCT series offers improved switching speeds compared to standard TTL equivalents while maintaining compatibility. Consider the 3-state output capability for multiplexed bus environments where multiple drivers share the same physical lines without interference.
This part belongs to the SN74BCT family of high-speed CMOS logic devices. It serves as a functional equivalent to older ALS technology but with optimized power and speed characteristics. The device is designed for applications demanding reliable data transmission in digital systems, providing robust drive capabilities for standard loads.
The SN74BCT29828BDW is a documented tube-packaged alternative from the same manufacturer. Verify pinout compatibility and electrical parameter equivalence before substitution. Ensure the replacement package type aligns with existing assembly processes.
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