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SN74GTLP817PWR is listed in the Translators, Level Shifters range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC TRANSLATOR BIDIR 24TSSOP. Review the specifications below when checking this part for your BOM.
The SN74GTLP817PWR is a bidirectional mixed-signal level translator manufactured by Texas Instruments in a 24-TSSOP package. It provides LVTTL-to-GTLP translation with a 1-to-2 fanout driver and GTLP-to-LVTTL translation with a 1-to-6 fanout driver. The device operates at VCC = 3.3V, supporting GTL (VTT=1.2V) and GTLP (VTT=1.5V) standards. It features variable edge-rate control (ERC), Ioff for hot-insertion support, and distributed VCC/GND pins to minimize switching noise.
Verify the specific ordering suffix 'PWR' corresponds to the Tape and Reel packaging variant of the SN74GTLP817. Confirm that the required operating temperature range matches the -40°C to 85°C specification. Ensure the design accommodates the 24-TSSOP physical dimensions and pinout configuration provided in the datasheet mechanical data section.
Select this component when interfacing LVTTL logic with GTLP backplanes requiring medium-drive capabilities. The ERC feature allows optimization of rise and fall times for specific load impedances. Verify compatibility with both GTL and GTLP termination voltages. Consider the separate GNDT and GNDG pins if isolated grounds are necessary for noise reduction.
This part belongs to the 74GTLP series of mixed-signal converters from Texas Instruments. It functions as a fanout driver providing signal-level translation between different logic families. The PWR suffix indicates the TSSOP surface-mount package type, distinguishing it from tube-packaged SOIC variants like the DW suffix.
SN74GTLP817DW
The ERC input adjusts the B-port output rise and fall times. Connecting ERC to VCC selects slow edge rates, while connecting it to GND selects fast edge rates, allowing optimization for data-transfer rate and signal integrity.
The Ioff circuitry disables the outputs when the device is powered down, preventing damaging current backflow through the device during hot-insertion scenarios.
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