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SN74LS244DBR is listed in the Buffers, Drivers, Receivers, Transceivers range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC BUF NON-INVERT 5.25V 20SSOP. Review the specifications below when checking this part for your BOM.
The SN74LS244DBR is an octal buffer and line driver manufactured by Texas Instruments, belonging to the SN74LS logic series. It features eight non-inverting inputs and outputs with three-state capability, housed in a 20-pin SOIC surface-mount package. The device operates within a supply voltage range of 4.75 V to 5.25 V. Key electrical parameters include a maximum propagation delay of 18 ns, high-level output current of -15 mA, low-level output current of 24 mA, and static current of 27 mA. It supports a wide operating temperature range from 0°C to +70°C.
Verify the specific suffix 'DBR' corresponds to the tape-and-reel packaging format when ordering. Confirm that the required operating temperature range aligns with the industrial specification of 0°C to +70°C. Ensure compatibility with standard 5V TTL logic levels before integration into the design.
Select this component for designs requiring robust signal buffering with high fan-out capabilities. The LS logic family offers a balance between power consumption and speed suitable for general-purpose digital systems. Consider the SOIC-20 package dimensions for PCB layout constraints and thermal management requirements during the selection phase.
This part belongs to the widely used 74LSxx series of bipolar logic devices. It serves as a fundamental building block for digital signal routing. The octal configuration allows for efficient handling of parallel data buses. Its three-state feature enables multiple devices to share common communication lines without interference.
Direct replacements include SN74LS244DR and SN74LS244DW. Cross-manufacturer equivalents such as MC74LS244ADWR are available but require verification of pinout and electrical characteristics against the original datasheet specifications.
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