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SN74LVC1G00YEPR is listed in the Inverter Gates range at ChipApex. The manufacturer field lists Texas Instruments. Its product description is IC GATE NAND 1CH 2-INP 5DSBGA. Review the specifications below when checking this part for your BOM.
The SN74LVC1G00YEPR is a single 2-input positive-NAND gate from the Texas Instruments LVC logic series, designed for operation within a supply voltage range of 1.65 V to 5.5 V. It utilizes NanoStar package technology with a YEP (WCSP DSBGA) footprint featuring 0.23-mm large bumps. The device supports 5-V VCC operation and accepts input voltages up to 5.5 V. Electrical characteristics include a maximum propagation delay of 3.8 ns at 3.3 V and an output drive capability of ±24 mA at 3.3 V. It features low power consumption with a maximum ICC of 10 µA and includes Ioff circuitry to support partial-power-down mode by disabling outputs to prevent backflow current.
Verify the specific ordering suffix YEPR corresponds to the NanoStar WCSP package with 0.23-mm large bumps and reel quantity of 3000 units. Confirm the operating temperature range is -40°C to 85°C. Ensure compatibility with PCB design guidelines for the YEP package type provided in the manufacturer documentation.
Select this component when a compact single NAND gate is required for space-constrained designs using NanoStar technology. It is suitable for systems needing 5-V tolerance on inputs while operating at lower voltages down to 1.65 V. Consider the Ioff feature if the application involves partial-power-down scenarios to protect downstream components from backflow currents.
This part belongs to the SN74LVC1G00 family of single-function gates manufactured by Texas Instruments. The LVC series is characterized by wide supply voltage ranges and high-speed performance. The YEPR suffix specifically denotes the NanoStar WCSP package variant, distinguishing it from other package options like SOT-23 or SC-70 available within the same logical function family.
Direct substitutes within the same package and electrical specifications should be verified against the official TI pinout and thermal data. Cross-referencing with other LVC series NAND gates requires confirmation of identical package dimensions and bump configurations to ensure mechanical fit.
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