Diode Arrays SR3040PT product image

SR3040PT

$0.79
  • Description:DIODE ARR SCHOTT 40V 30A TO247AD
  • Series:-

SKU:712cbaf2c0ae Category: Brand:

  
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SR3040PT is listed in the Diode Arrays range at ChipApex. The manufacturer field lists Taiwan Semiconductor Corporation. Its product description is DIODE ARR SCHOTT 40V 30A TO247AD. Review the specifications below when checking this part for your BOM.

Diode Arrays specifications for SR3040PT

  • Description:DIODE ARR SCHOTT 40V 30A TO247AD
  • Series:-
  • Mfr:Taiwan Semiconductor Corporation
  • Package:Tube
  • Diode Configuration:1 Pair Common Cathode
  • Technology:Schottky
  • Voltage - DC Reverse (Vr) (Max):40 V
  • Current - Average Rectified (Io) (per Diode):30A
  • Voltage - Forward (Vf) (Max) @ If:550 mV @ 15 A
  • Speed:Fast Recovery =< 500ns, > 200mA (Io)
  • Reverse Recovery Time (trr):-
  • Current - Reverse Leakage @ Vr:1 mA @ 40 V
  • Operating Temperature - Junction:-55°C ~ 125°C
  • Mounting Type:Through Hole
  • Package / Case:TO-247-3
  • Supplier Device Package:TO-247AD (TO-3P)
  • Grade:-
  • Qualification:-

Diode Arrays datasheet and documents for SR3040PT

SR3040PT

Diode Arrays Overview

The SR3040PT is a Schottky rectifier diode manufactured by Taiwan Semiconductor Corporation. It features a common cathode configuration with two internal elements housed in a TO-251 (SMB) surface-mount package. The device is rated for a maximum average forward current of 3.0 A and a repetitive peak reverse voltage of 40 V. Key electrical parameters include a maximum DC forward voltage of 0.55 V at 3.0 A and a non-repetitive peak forward surge current capability of 70 A. The component operates within a junction temperature range of -55 °C to +175 °C, ensuring reliability under high thermal stress conditions.

Diode Arrays Feature Summary

  • Schottky barrier construction provides low forward voltage drop and minimal power loss
  • Common cathode dual-element design simplifies circuit layout for bridge or freewheeling applications
  • High thermal stability supports operation up to 175 °C junction temperature
  • Surface-mount TO-251 package enables automated assembly and compact board integration

Diode Arrays Applications

  • DC-DC converter output rectification
  • Freewheeling diodes in synchronous rectifier circuits
  • Power supply input protection against reverse polarity
  • Low voltage high frequency rectification in consumer electronics

Diode Arrays Procurement Notes

Verify the manufacturer marking on the component body matches Taiwan Semiconductor Corporation specifications. Confirm the package type is TO-251 (SMB) and the pinout corresponds to common cathode configuration. Check datasheet revisions for any changes in mechanical dimensions or thermal characteristics. Ensure compliance with RoHS directives if required by your application standards. Cross-reference part numbers carefully as suffixes may indicate packaging variations.

Diode Arrays Selection Notes

Select this component when low forward voltage drop is critical for efficiency in low-voltage applications. The 40 V rating suits systems with nominal voltages up to 24 V. Consider the 3.0 A continuous current limit and ensure adequate heatsinking or PCB copper area for thermal management. The TO-251 package requires appropriate footprint design for reliable soldering. Evaluate reverse leakage current specifications if operating at elevated temperatures.

Diode Arrays Part Context

This Schottky rectifier belongs to the family of surface-mount power diodes designed for general-purpose rectification. It complements other SMB-packaged devices offering similar current ratings but different voltage capabilities. The common cathode configuration allows use in full-wave rectifier circuits without requiring external diode bridges. It serves as an alternative to through-hole packages where space constraints are significant.

Diode Arrays Replacement Considerations

Direct replacements must match the 3.0 A current rating, 40 V reverse voltage, and TO-251 package. Verify that substitute components maintain equivalent forward voltage characteristics and thermal performance. Check for identical pinout configurations to ensure compatibility with existing PCB layouts.

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