SSTUB32S868BHLF

Specialty Logic Overview

The SSTUB32S868BHLF is a registered buffer integrated circuit designed for DDR2 memory applications. Manufactured by Renesas Electronics Corporation, this component operates within a supply voltage range of 1.7V to 1.9V. It features a 25-bit data width and utilizes a surface-mount installation type. The device is housed in a 176-TFBGA package, specifically identified as 176-CABGA with dimensions of 6x15 mm.

Specialty Logic Feature Summary

• Configurable registered buffer architecture optimized for DDR2 signal integrity
• Low voltage operation supporting 1.7V to 1.9V power supplies
• High-density surface mount packaging for compact board integration

Specialty Logic Applications

• DDR2 memory subsystem buffering
• High-speed digital data transmission lines
• System control applications requiring registered memory interfaces

Specialty Logic Procurement Notes

Verify the specific suffix 'HLF' against the official Renesas datasheet to confirm package variant and material compliance. Ensure the design supports the required 1.7V to 1.9V operating voltage range. Confirm thermal management requirements for the 176-CABGA package during implementation.

Specialty Logic Selection Notes

Select this component when designing DDR2 memory interfaces requiring registered buffering. Verify compatibility with the target system's voltage levels and timing constraints. Consider the 176-pin TFBGA footprint for PCB layout planning and ensure adequate clearance for the specified package dimensions.

Specialty Logic Part Context

This part belongs to the SSTUB series of registered buffers from Renesas Electronics. These components are specialized logic chips intended to improve signal quality in high-speed memory systems. The SSTUB32S868BHLF represents a specific configuration within this family tailored for DDR2 standards.

Specialty Logic Replacement Considerations

Consult Renesas documentation for pin-compatible alternatives or next-generation replacements. Verify electrical specifications and package dimensions before substituting any other registered buffer ICs.