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STA8090WG26 is listed in the RF Receivers range at ChipApex. The manufacturer field lists STMicroelectronics. Its product description is ADD INFOTAINMENT. Review the specifications below when checking this part for your BOM.
The STA8090WG26 is a single-die standalone GNSS positioning receiver from the Teseo III family, integrating an ARM946 MCU running at 196 MHz with embedded RF front-end and low-noise amplifier. It supports GPS, Galileo, GLONASS, BeiDou, and QZSS systems via 48 tracking channels and 2 fast acquisition channels. Key electrical parameters include indoor sensitivity of -162 dBm in tracking mode, hot start TTFF under 1 second, and cold start TTFF of 30 seconds. The device operates on main voltage (VINL) from 1.6 V to 4.3 V, backup voltage (VINB) from 1.6 V to 4.3 V, digital voltage (VDD) from 1.0 V to 1.32 V, RF core voltage (VCC) at 1.2 V ± 10%, and IO ring voltage (VddIO) at 1.8 V ± 5% or 3.3 V ± 10%. It features 256 Kbyte SRAM, external SQI Flash interface, three UARTs, I2C, SSP, USB 2.0, CAN, RTC, and timers.
Verify component authenticity through authorized STMicroelectronics distributors or official manufacturer channels. Confirm package type matches WLCSP77 specifications and check lifecycle status, as this model may be obsolete. Ensure environmental compliance documentation aligns with project requirements. Validate pinout compatibility if replacing existing designs. Request full datasheet and application notes for integration support.
Select this component for applications requiring multi-constellation GNSS support in compact form factors. Consider the integrated ARM946 MCU for processing-intensive tasks without external controllers. Evaluate power supply requirements across multiple voltage domains. Assess thermal performance within the specified operating temperature range. Verify interface compatibility with host system protocols.
The STA8090WG26 belongs to the Teseo III family of GNSS receivers designed for low-cost, small-footprint applications. It combines RF functionality with baseband processing in a single die, reducing bill of materials complexity. This integration enables efficient design for portable devices where space and power consumption are critical constraints.
Check for direct substitutes within the Teseo III series or newer generations like Teseo IV. Verify pin-to-pin compatibility and software migration paths. Confirm that alternative components maintain similar sensitivity and TTFF performance metrics.
It supports GPS, Galileo, GLONASS, BeiDou, and QZSS systems simultaneously.
The cold start TTFF is typically 30 seconds.
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