SX3M156.250A10F20TNN

Oscillators Overview

The SX3M156.250A10F20TNN is a CMOS crystal oscillator (XO) manufactured by Shenzhen SCTF Electronics. It operates at a fundamental frequency of 156.25 MHz and utilizes standard CMOS output logic levels. The component features a 5V enable/disable control function, allowing for power management within the host circuit. It is housed in a compact 4-SMD, no-lead surface-mount package designed for automated assembly processes. This oscillator provides a stable clock signal suitable for digital systems requiring precise timing synchronization.

Oscillators Feature Summary

• Integrates an enable/disable pin for active power control
• Delivers standard CMOS output voltage levels
• Utilizes a leadless surface-mount package for board space efficiency

Oscillators Applications

• Digital communication equipment clocking
• Data processing system timing references
• Embedded controller synchronization

Oscillators Procurement Notes

Verify the manufacturer part number against official datasheets to confirm the specific enable/disable functionality and electrical characteristics. Ensure the ordering suffix matches the required tolerance and temperature range specifications for the target application environment.

Oscillators Selection Notes

Select this component when a fixed 156.25 MHz clock source with integrated power gating is required. Consider the 4-SMD footprint constraints and CMOS drive capability relative to the load capacitance of the connected circuitry during design integration.

Oscillators Part Context

This model belongs to the series of surface-mount crystal oscillators produced by Shenzhen SCTF Electronics. These components are engineered to provide reliable frequency generation for modern electronic assemblies, replacing discrete crystal and amplifier configurations with a unified solution.

Oscillators Replacement Considerations

Consult official substitution lists from Shenzhen SCTF Electronics for direct replacements. Verify that any alternative part maintains identical frequency, package dimensions, and CMOS output specifications.