TDB6HK360N16PBOSA1

SCRs - Modules Overview

The TDB6HK360N16PBOSA1 is an IGBT module from Infineon Technologies, utilizing the EconoPACK™4 housing with PressFIT technology and integrated NTC thermistor. It features a half-controlled bridge topology with Si IGBTs rated at 1600V collector-emitter voltage and 360A RMS current. The device supports a maximum surge forward current of 2300A for diode-rectifier applications and includes a thyristor-rectifier configuration. Key electrical parameters include a repetitive peak reverse voltage of 1600V, continuous forward current of 360A per chip, and a threshold voltage of 1.85V to 2.1V.

SCRs - Modules Feature Summary

• EconoPACK™4 housing design optimized for high power density and mechanical robustness
• PressFIT connection technology eliminating solder joints for improved thermal cycling reliability
• Integrated NTC thermistor for precise temperature monitoring and protection
• Half-controlled bridge topology combining IGBTs and diodes in a single compact package

SCRs - Modules Applications

• Active rectifiers
• Half-controlled B6 bridges
• Industrial motor drives
• Uninterruptible power supplies (UPS)

SCRs - Modules Procurement Notes

Verify component authenticity through authorized Infineon distributors or direct channels. Confirm datasheet revision v02_00 matches procurement specifications. Ensure handling procedures align with manufacturer guidelines for PressFIT modules. Validate RoHS compliance status prior to integration into final assemblies.

SCRs - Modules Selection Notes

Evaluate thermal management requirements against the specified junction-to-case thermal resistance. Consider system voltage levels relative to the 1600V rating. Assess mechanical constraints for PressFIT mounting compatibility. Review NTC characteristics for accurate thermal feedback loop design within the application circuit.

SCRs - Modules Part Context

This component belongs to Infineon's EconoPACK™4 family, designed for high-power industrial applications. It represents an evolution in module packaging, focusing on reliability through PressFIT connections. The series targets demanding environments requiring high current handling and efficient thermal dissipation.

SCRs - Modules Replacement Considerations

Consult official cross-reference lists for compatible alternatives. Verify pinout and thermal interface compatibility before substitution. Ensure replacement parts meet identical voltage and current ratings. Check for updated datasheet revisions that may affect performance characteristics.