SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The MAMAC Systems TE-703-C-17-A-2 is an immersion temperature sensor designed for building automation and industrial applications. It features a galvanized sheet metal enclosure rated NEMA-1/IP-30. The unit utilizes a 20,000 ohm thermistor element housed within a 4-inch probe length. Installation is facilitated by a 1/4 inch NPT adapter included with the assembly.
Verify the specific enclosure material and fitting dimensions against project requirements. Confirm that the NEMA-1 rating aligns with the installation environment's protection needs. Ensure the 1/4 inch NPT adapter matches existing piping or tank connections to guarantee proper mechanical fit and sealing integrity.
Select this model when a robust, corrosion-resistant enclosure is required for immersion use. The galvanized steel construction offers durability in commercial settings. Verify compatibility with control systems accepting 20,000 ohm thermistor inputs before finalizing the procurement decision.
This component belongs to the TE-703/704 series of immersion and surface temperature sensors from MAMAC Systems. These sensors are engineered for precision remote temperature sensing in HVAC and industrial contexts. The series provides extensive options for enclosures and sensor types to meet diverse application demands.
Cross-reference with other TE-703 variants if different enclosure ratings or probe lengths are needed. Ensure substitute parts maintain the 20,000 ohm thermistor specification and compatible 1/4 inch NPT connection for direct interchangeability.

STMicroelectronics (ST), a global leader in semiconductor manufacturing, has officially notified customers of a new round of price increases for selected products, set to…
Read More
What Is NOR Flash? Why It Still Powers Critical Embedded Systems When your car’s engine control unit boots in milliseconds…When a medical device executes…
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read MoreWilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More