SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSM-06-30-080-50-06-N1 is a rectangular military specification connector from the AirBorn verSI series, manufactured by Molex. It functions as a vertical male header with 180 positions arranged in 6 rows and 30 columns. The component features a 0.050-inch (1.27mm) pitch and utilizes press-fit termination for board mounting. It includes fixed jacknuts accommodating a maximum board thickness of 0.125 inches.
Verify the exact datasheet revision before finalizing designs, as AirBorn documents may undergo updates. Confirm that the press-fit termination style matches your PCB fabrication capabilities. Ensure the fixed jacknut constraint aligns with your assembly board thickness requirements. Cross-reference the part number against current Molex/AirBorn catalogs to confirm availability status.
Select this component when a vertical male header with press-fit termination is required. The 1.27mm pitch supports high-density layouts within constrained spaces. Verify compatibility with mating receptacles in the same verSI series. Consider the fixed jacknut limitation if variable board thicknesses are present in the assembly stack.
This part belongs to the AirBorn verSI family of open-pin field PCB connectors. The series offers various mounting styles including vertical and right-angle options. It is engineered for demanding environments, providing reliable connectivity for critical systems. The manufacturer, now part of Molex, maintains strict quality standards for these military-grade components.
Consult official Molex/AirBorn substitution guides for verified equivalents. Generic replacements may not match the MIL-DTL-83513 specifications or press-fit mechanical tolerances. Ensure any substitute maintains the 1.27mm pitch and 180-position configuration.

Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More