SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AirBorn VSM-08-10-100-50-04-L1 is a high-density, board-to-board connector system designed for demanding electronic applications. It features a vertical mating configuration with a 2.54 mm (0.100 inch) pitch and an 8-row arrangement. The assembly utilizes gold-plated contacts to ensure reliable signal transmission and low contact resistance in high-cycle environments. This specific model includes a 100-position interface, engineered for robust mechanical stability and consistent electrical performance across various industrial and commercial sectors.
Verify the complete part number against official AirBorn documentation to confirm pin count, row configuration, and termination style. Ensure compatibility with mating connectors regarding pitch and housing dimensions. Request certified test reports for contact resistance and insulation resistance if required by your quality management system. Confirm that the specified plating thickness meets your environmental durability requirements before finalizing procurement orders.
Select this component based on the required number of positions and the specific vertical height needed for your enclosure design. Evaluate the operating temperature range and vibration resistance specifications against your application's environmental conditions. Consider the mating cycle requirements to determine if the standard contact materials are sufficient or if enhanced durability options are necessary for long-term reliability.
This connector belongs to the VSM series, which is characterized by its high-density capabilities and robust construction. The series is widely utilized in applications where space constraints are critical but high signal integrity must be maintained. AirBorn designs these components to meet rigorous industry standards for performance and longevity in challenging operational environments.
Consult official AirBorn cross-reference guides for verified substitute part numbers. Ensure any replacement maintains identical pitch, row count, and mounting configuration. Verify that alternative suppliers provide equivalent material specifications and dimensional tolerances to guarantee seamless integration without redesigning the printed circuit board.

See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
[Shenzhen/Shanghai/Beijing, January 2025] — As global digital transformation accelerates, the electronic components industry has reached a critical inflection point in 2025. Emerging fields such…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
Geneva, Switzerland – March 25, 2026 – STMicroelectronics N.V. (NYSE: STM), a global semiconductor leader serving customers across the electronics applications spectrum, has announced…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More