SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The VSM-08-50-100-50-06-L1 is a rectangular MIL-Spec connector from the AirBorn verSI series, manufactured by Molex. It features a vertical male interface with a 1.27 mm pitch and liquid crystal polymer body. The component provides 400 positions across 8 rows and 50 columns, utilizing gold-plated phosphor bronze contacts. Designed for through-hole board mounting, it supports a 10.00 mm board spacing and includes guide pins for alignment. Rated for 2 A current at 200 V, it operates between -55 C and +125 C.
Verify the specific suffix L1 against official datasheets to confirm lead time requirements and ordering constraints. Confirm that the manufacturer accepts factory special orders for this configuration. Ensure compatibility with mating receptacles before procurement.
Select this model when a vertical male connector with 400 circuits is required. Verify that the 10.00 mm board spacing matches the target assembly height. Confirm that the through-hole termination style aligns with the manufacturing process capabilities.
This part belongs to the AirBorn verSI family of high-reliability connectors. The series is designed for demanding environments requiring robust signal integrity and mechanical stability. The VSM designation indicates a vertical male configuration within the broader product line.
Consult official cross-reference guides for verified substitutes. Ensure any replacement maintains the same pin count, pitch, and MIL-DTL-83513 compliance. Verify physical dimensions and mounting hole patterns match exactly.

Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
In embedded design, the tug-of-war between cost and performance is constant. On one side, you have Microcontrollers (MCUs)—cheap, simple, and efficient. On the other,…
Read More
Vishay Intertechnology, Inc., a global leader in discrete semiconductors and passive electronic components, has officially announced a price adjustment for its Metal-Oxide-Semiconductor Field-Effect Transistors…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
In the vast landscape of memory technology, EEPROM (Electrically Erasable Programmable Read-Only Memory) often plays the unsung hero. While NAND Flash grabs headlines for…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More