SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The AirBorn VSM-10-30-200-50-03-L is a vertical male board stacking connector from the verSI series, designed for high-density PCB interconnects. It features a 1.27 mm pitch and comprises 10 rows with 30 columns, providing 300 circuits. The unit utilizes a plastic liquid crystal polymer (LCP) body and phosphor bronze contacts with gold plating. Termination is achieved via through-hole mounting with a 0.109-inch tail length. The connector supports a maximum board spacing of 200 mm and operates within a temperature range of -55°C to +125°C.
Verify the specific termination style suffix against current manufacturer documentation, as legacy codes may differ. Confirm compliance with MIL-DTL-83513 standards required for your application environment. Ensure that the 0.109-inch tail length matches your target PCB thickness constraints. Cross-reference the latest datasheet revision before finalizing design integration to avoid obsolete configuration errors.
Select this component when a vertical male plug is required for dense signal routing between stacked boards. The 1.27 mm pitch allows for significant I/O density within constrained footprints. Verify that the LCP housing material meets thermal requirements for your specific operating environment. Ensure mating receptacles are selected from the compatible VRF series to maintain proper alignment and electrical continuity.
This part belongs to the AirBorn verSI series, which provides modular rectangular connectors compliant with MIL-DTL-83513. The series offers various row and column configurations to accommodate different circuit counts. The VSM designation specifically indicates a vertical male plug variant, distinguishing it from right-angle or female receptacle options within the same product family.
Direct substitutes include other VSM series variants with matching row and column counts. Compatible mating components are found in the VRF series receptacles. Verify mechanical dimensions and pinout compatibility before substituting any alternative part numbers.

TOKYO, April 15, 2026 – Taiyo Yuden Co., Ltd. (TAIYO YUDEN), a leading global manufacturer of passive electronic components, has officially notified its worldwide…
Read More-768x745.jpg)
CHICAGO, USA – May 27, 2026 – Global leading interconnect manufacturer Molex officially issued a global distributor price adjustment notice on May 27, confirming…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read MoreSeptember 16, 2026 – Global — Leading semiconductor manufacturer ON Semiconductor (onsemi, NASDAQ: ON) has officially issued a formal price adjustment letter to global…
Read MoreMay 4, 2026 — The global power semiconductor market is grappling with a worsening supply crunch, as lead times for key components have extended…
Read More
Understand how a comparator switches at a voltage threshold, why hysteresis prevents chatter, and which output and input specs matter.
Read More
On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
Read More
In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
Read More
An RF IC, or radio-frequency integrated circuit, is a chip that processes wireless signals between the antenna and the baseband processor. Instead of building…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More