W35N04JWTBIF

Memory IC Overview

The W35N04JWTBIF is a 4G-bit Octal NAND flash memory device manufactured by Winbond Electronics. It operates at a supply voltage of 1.7V to 1.95V and supports a clock frequency of 166 MHz. The component utilizes SPI with eight I/O lines for data transfer. It is housed in a 24-TFBGA package measuring 8x6 mm. The memory organization is specified as 512M x 8 bits. It functions within an operating temperature range of -40°C to 85°C (TA). The device is classified as non-volatile SLC NAND flash technology.

Memory IC Feature Summary

• Supports high-speed data transfer via SPI interface with eight input/output lines
• Provides reliable non-volatile storage using Single-Level Cell NAND technology
• Operates within industrial temperature ranges for robust performance

Memory IC Applications

• Embedded systems requiring compact non-volatile storage
• Industrial control devices needing wide temperature operation
• Consumer electronics utilizing surface-mount assembly

Memory IC Procurement Notes

Verify current availability status directly with the manufacturer or authorized distributors, as supply constraints may affect immediate fulfillment. Confirm moisture sensitivity level handling requirements during storage and assembly processes. Ensure compatibility with existing board designs regarding the 24-TFBGA footprint and pin configuration before finalizing procurement orders.

Memory IC Selection Notes

Select this component when a 4G-bit capacity is required with octal interface speeds up to 166 MHz. Consider the specific 1.8V power domain requirements and the 24-TFBGA package dimensions for PCB layout. Verify that the application environment falls within the specified -40°C to 85°C operating temperature range for optimal reliability.

Memory IC Part Context

This part belongs to the W35N series of Octal NAND flash memories from Winbond. It shares the same TFBGA-24 package form factor with other variants in the family but differs in capacity and interface speed specifications. The series targets applications demanding high-density storage in small footprints.

Memory IC Replacement Considerations

Direct substitutes include other 4G-bit Octal NAND flash devices in 24-TFBGA packages from compatible manufacturers. Verify electrical parameters such as voltage range and clock frequency match exactly. Check pinout compatibility to ensure seamless integration without redesigning the host circuit board.