W631GG8KB-12

Memory IC Overview

The W631GG8KB-12 is a 1 Gbit DDR3 SDRAM organized as 16M x 8 with eight internal banks. It supports a maximum operating frequency of 800 MHz (DDR3-1600) and utilizes a 78-ball WBGA package. The device operates within a voltage range of 1.425 V to 1.575 V for VDD and VDDQ, with an industrial temperature grade (-12I) supporting -40°C to 95°C.

Memory IC Feature Summary

• Supports double data rate architecture with differential clock inputs and source-synchronous data strobes.
• Features programmable on-die termination and dynamic ODT modes for signal integrity.
• Includes multi-purpose register support for system timing calibration via write leveling.
• Provides asynchronous reset functionality and multiple power-down modes.

Memory IC Applications

• High-speed embedded memory systems
• Industrial control modules
• Communication equipment

Memory IC Procurement Notes

Verify the specific speed grade suffix (e.g., -12 vs 12I) against the required operating temperature range. Confirm package type compatibility during sourcing. Check manufacturer discontinuation notices as availability may be limited.

Memory IC Selection Notes

Select based on required clock frequency and temperature specifications. Ensure controller supports DDR3-1600 timings. Verify PCB layout constraints for the 78-ball WBGA footprint and differential signaling requirements.

Memory IC Part Context

Part of the Winbond W631GG8KB family of 1Gb DDR3 SDRAM devices. Designed for applications requiring high bandwidth and low power consumption. Complies with JEDEC standards for DDR3 interface.

Memory IC Replacement Considerations

Check for direct pin-compatible alternatives from Winbond or other manufacturers offering equivalent 1Gb DDR3 specifications in a 78-ball package.