W63AH6NBVACI

Memory IC Overview

The Winbond W63AH6NBVACI is a 1Gb LPDDR3 SDRAM device organized as 64M x 16. It operates with a maximum clock frequency of 800 MHz and utilizes a VFBGA-178 package. The component supports an industrial temperature range from -40°C to +85°C. Power supply requirements include VDD1 between 1.14V and 1.3V, and VDDQ between 1.7V and 1.95V.

Memory IC Feature Summary

• Supports double data rate architecture on the Command/Address bus to reduce input pin count
• Includes Partial Array Self-Refresh (PASR) for power optimization
• Features On-Die Termination (ODT) control via mode registers
• Integrates CA Training and Write Leveling capabilities

Memory IC Applications

• Mobile consumer electronics
• Industrial control systems
• Automotive infotainment units

Memory IC Procurement Notes

Verify the specific ordering suffix against official documentation to confirm package type and temperature grade. Confirm current lifecycle status directly with the manufacturer or authorized distributors before finalizing procurement plans.

Memory IC Selection Notes

Select this component for designs requiring high-speed mobile memory within an industrial temperature environment. Ensure the system design accommodates the specified dual voltage rails and utilizes the 178-pin VFBGA footprint constraints.

Memory IC Part Context

This part belongs to the W63AHxNB series of LPDDR3 devices manufactured by Winbond Electronics. It is designed for applications demanding high bandwidth and low power consumption in compact form factors.

Memory IC Replacement Considerations

Consult official substitution lists for verified equivalents. Generic cross-references may not match electrical characteristics or pin configurations.