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WGV50PD9JTA is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists AirBorn, a Molex company. Its product description is WGV50PD9JTA. Review the specifications below when checking this part for your BOM.
The WGV50PD9JTA is a rectangular MIL-Spec connector from the AirBorn W Series, compliant with MIL-DTL-55302. It features a board mount plug configuration with male pin contacts and a three-row arrangement providing 50 positions. The component utilizes through-hole termination with a 2.54 mm (0.100 inch) pitch. Constructed with a Polyphenylene Sulfide (PPS) housing and copper alloy contacts, it supports a current rating of 5 A and operates within a temperature range of -65 °C to +125 °C.
Verify the specific manufacturer part number against official Molex/AirBorn documentation to ensure compliance with MIL-DTL-55302 standards. Confirm that the three-row configuration and through-hole termination match the design requirements. Cross-reference contact plating and housing material specifications to guarantee environmental suitability for the intended operational temperature range.
Select this component when a MIL-DTL-55302 compliant, three-row board mount plug is required. Ensure the 50-position count and 2.54 mm pitch align with the PCB layout. Verify that the straight mounting style and through-hole termination are compatible with the assembly process. Consider the 5 A current rating and PPS material properties for thermal management needs.
This part belongs to the AirBorn W Series, designed for mission-critical applications demanding high density and reliability. The series offers various row options and contact counts, supporting both pin and socket configurations. The WGV50PD9JTA specifically addresses the need for robust, multi-row interconnections in harsh environments, adhering to strict military performance standards.
Direct substitutes must maintain MIL-DTL-55302 compliance, a 50-position three-row layout, and through-hole pin termination. Verify identical electrical ratings and housing materials. Generic equivalents may not meet the rigorous qualification standards required for military or aerospace deployment.
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