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XC2VP7-6FFG672C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 396 I/O 672FCBGA. Review the specifications below when checking this part for your BOM.
The AMD XC2VP7-6FFG672C is a Virtex-II Pro FPGA utilizing a 0.13 µm CMOS process. It features 11,088 logic cells and 4,928 slices within the configurable logic block array. The device integrates eight RocketIO multi-gigabit transceiver blocks and one PowerPC 405 processor core. It supports up to 396 user I/O pads in the FF672 flip-chip package. Embedded memory includes 792 Kb of distributed RAM and 396 Kb of block RAM. The -6 speed grade enables RocketIO data rates up to 3.125 Gb/s and PowerPC operation at 350 MHz.
Verify component authenticity through authorized distribution channels. Confirm RoHS compliance status as lead-free packaging options exist for specific wire-bond variants. Check datasheet revision history for any pinout or electrical characteristic updates prior to finalizing procurement specifications.
Select this model for designs requiring embedded RISC processing alongside high-bandwidth serial connectivity. Ensure the FF672 package meets board space constraints. Verify that the -6 speed grade performance aligns with system timing requirements for both logic and transceiver interfaces.
This component belongs to the Virtex-II Pro family, representing a platform FPGA solution combining programmable logic with embedded processors. It serves as an alternative to ASICs for high-volume production while maintaining design flexibility. The architecture supports complex system-on-chip implementations.
No direct public substitutes are documented. Consider migrating to newer Xilinx families such as Virtex-5 or Virtex-6 for enhanced performance and updated support, noting significant architectural differences in configuration and resource utilization.
The -6 speed grade supports a maximum baud rate of 3.125 Gb/s for the RocketIO transceivers.
The XC2VP7 device contains one embedded PowerPC 405 processor block.
Yes, the FF672 package bonds out all eight RocketIO transceiver blocks available in the XC2VP7 device.
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