Field Programmable Gate Array XC3S1500-4FG676C product image

XC3S1500-4FG676C

$304.98
  • Description:IC FPGA 487 I/O 676FCBGA
  • Series:Spartan®-3

SKU:c1292f329ee3 Category: Brand:

  
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XC3S1500-4FG676C is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 487 I/O 676FCBGA. Review the specifications below when checking this part for your BOM.

Field Programmable Gate Array specifications for XC3S1500-4FG676C

  • Description:IC FPGA 487 I/O 676FCBGA
  • Series:Spartan®-3
  • Mfr:AMD
  • Package:Tray
  • Number of LABs/CLBs:3328
  • Number of Logic Elements/Cells:29952
  • Total RAM Bits:589824
  • Number of I/O:487
  • Voltage - Supply:1.14V ~ 1.26V
  • Mounting Type:Surface Mount
  • Operating Temperature:0°C ~ 85°C (TJ)
  • Package / Case:676-BGA
  • Supplier Device Package:676-FBGA (27x27)
  • Number of Gates:1500000
  • Grade:-
  • Qualification:-

Field Programmable Gate Array datasheet and documents for XC3S1500-4FG676C

XC3S1500-4FG676C

Field Programmable Gate Array Overview

The XC3S1500-4FG676C is a Field Programmable Gate Array from the AMD Spartan-3 family, manufactured using 90 nm technology. It features 748,800 logic elements and 8,320 Logic Array Blocks (LABs). The device includes 1,916,928 bits of embedded block RAM and supports up to 489 user I/Os. Operating at a maximum frequency of 600 MHz with a -4 speed grade, it functions within a supply voltage range of 1.14 V to 1.26 V. The component is housed in a 676-ball FBGA package and operates between 0°C and +85°C.

Field Programmable Gate Array Feature Summary

  • High-density programmable logic architecture utilizing 90 nm CMOS technology for efficient signal processing.
  • Integrated high-performance block RAM resources designed for buffering and queue management applications.
  • Supports multiple configuration modes including serial, parallel SelectMAP, and JTAG programming interfaces.

Field Programmable Gate Array Applications

  • Glue logic replacement and interface bridging in embedded systems
  • Low-speed data acquisition and signal conditioning tasks
  • Prototyping for ASIC designs requiring moderate logic density

Field Programmable Gate Array Procurement Notes

Verify RoHS compliance status and moisture sensitivity level (MSL 3) prior to assembly. Confirm lead-free soldering profiles align with JEDEC standards. Check for obsolescence notices as this part may be discontinued. Ensure ESD protection measures are implemented during handling. Validate pinout compatibility with existing PCB footprints before procurement.

Field Programmable Gate Array Selection Notes

Select this model when design requirements exceed Spartan-3E capacity but do not necessitate Virtex performance. Compare against XC3S5000 variants if higher I/O counts are needed. Consider power consumption differences relative to newer Spartan-6 or Artix families. Verify that the 676-pin package fits within mechanical constraints. Evaluate timing closure feasibility at the -4 speed grade for target clock frequencies.

Field Programmable Gate Array Part Context

This component belongs to the Spartan-3 FPGA family, which targets cost-sensitive and I/O-intensive embedded applications. It serves as a bridge between lower-density devices like the Spartan-3A and higher-end solutions. The series is known for providing a balance of logic resources and affordable pricing for mid-volume production runs.

Field Programmable Gate Array Replacement Considerations

Publicly confirmed substitutes include LFE5U-85F-6BG756C from Lattice Semiconductor and T55F576C from Efinix. These alternatives offer comparable functionality but require architectural migration due to differing logic structures and I/O banks.

XC3S1500-4FG676CXC3S1500-4FG676C
$304.98
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