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XC5VLX50-2FF1153I is listed in the Field Programmable Gate Array range at ChipApex. The manufacturer field lists AMD. Its product description is IC FPGA 560 I/O 1153FCBGA. Review the specifications below when checking this part for your BOM.
The XC5VLX50-2FF1153I is a Virtex-5 LX Field Programmable Gate Array (FPGA) manufactured by AMD. It features 46,080 logic elements and 3,600 LABs/CLBs within a 1153-pin FCBGA package. The device supports up to 560 I/O pins and includes 1,769,472 total RAM bits. Operating at a supply voltage of 0.95V to 1.05V, it functions within an industrial temperature range of -40°C to +100°C.
Verify the specific suffix 'I' confirms the industrial temperature rating of -40°C to +100°C against official datasheets. Confirm the 1153-pin FCBGA package dimensions match the target PCB footprint. Ensure compatibility with existing power delivery networks operating between 0.95V and 1.05V. Check for moisture sensitivity level requirements during assembly handling.
Select this component when a balance of moderate logic density and high I/O count is required in a large package. Compare against the XC5VLX50T variant if integrated transceivers are necessary for serial communication. Consider the speed grade '-2' performance characteristics relative to timing constraints. Evaluate thermal management solutions suitable for the FCBGA form factor under maximum load conditions.
This part belongs to the AMD Virtex-5 LX family, designed for cost-sensitive applications requiring significant logic capacity. It shares architectural similarities with other LX devices but offers specific pin counts and memory configurations. The series is known for supporting advanced DSP slices and high-performance interconnects typical of the Virtex architecture generation.
Direct substitutes include other XC5VLX50 variants with different speed grades or packages, such as XC5VLX50-1FFG1153C or XC5VLX50-3FFG676C, provided pinouts and electrical parameters align. Cross-family migration to Virtex-6 or Artix-7 requires schematic and firmware redesign due to architectural differences.
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