XCVM1302-1LSINSVF1369

Soc System On Chip Overview

The AMD XCVM1302-1LSINSVF1369 is a Versal Adaptive SoC belonging to the Versal Premium series, manufactured on a 7nm process node. It integrates a heterogeneous architecture comprising programmable logic, AI Engines, DSP blocks, and a processing system with Arm Cortex-A72 and Cortex-R5F cores. The device features high-speed serial transceivers supporting up to 58 Gb/s rates and includes hardened PCIe Gen4/Gen5 interfaces. Designed for high-bandwidth applications, it offers extensive I/O capabilities within a 1369-ball package, targeting complex data path acceleration and real-time control requirements.

Soc System On Chip Feature Summary

• Heterogeneous adaptive compute platform integrating programmable logic, AI Engines, and scalar processors
• Hardened high-speed connectivity including PCIe Gen5/Gen4 compliance and multi-rate Ethernet subsystems
• Integrated DDR memory controllers supporting high-bandwidth LPDDR5 and DDR5 interfaces
• Dedicated safety and security management via triple-redundant Platform Management Controller

Soc System On Chip Applications

• Data center network acceleration and virtual switching
• 5G xHaul infrastructure and wireless backhaul
• Radar and advanced signal processing systems
• Storage acceleration and enterprise storage controllers

Soc System On Chip Procurement Notes

Verify the specific ordering suffix against the official AMD Xilinx datasheet to ensure correct package type, temperature range, and industrial specifications. Confirm availability status directly with authorized distributors as supply levels may vary. Request the latest version of the product specification document to validate pinout compatibility and electrical characteristics before finalizing procurement orders.

Soc System On Chip Selection Notes

Select this model when requiring a balance of high-performance AI Engine compute and robust programmable logic resources. Ensure the design utilizes the integrated hardened IP blocks for PCIe and Ethernet to maximize efficiency. Evaluate thermal requirements carefully due to the high density of the 7nm Versal architecture and the large ball grid array package size.

Soc System On Chip Part Context

This component is part of the AMD Versal Premium family, designed for demanding applications in networking, storage, and industrial sectors. It sits alongside other Versal models like the XCVP1802, offering scalable performance through its adaptable architecture. The Versal Prime and Premium series share common architectural foundations but differ in resource allocation and specific interface support configurations.

Soc System On Chip Replacement Considerations

Direct replacements are limited within the same Versal family. Consider the XCVM1302-2LSEVFVB1369 or XCVM1302-2LLEVFVB1369 if higher speed grades or alternative package options are required. Verify functional equivalence by comparing AI Engine counts, DSP resources, and transceiver speeds in the respective datasheets.