Soc System On Chip XCZU1CG-1SFVA625I product image

XCZU1CG-1SFVA625I

$274.04
  • Description:IC ZUP MPSOC CG A53 FPGA 635BGA
  • Series:Zynq® UltraScale+™ MPSoC CG

SKU:af8cb5425be4 Category: Brand:

  
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XCZU1CG-1SFVA625I is listed in the Soc System On Chip range at ChipApex. The manufacturer field lists AMD. Its product description is IC ZUP MPSOC CG A53 FPGA 635BGA. Review the specifications below when checking this part for your BOM.

Soc System On Chip specifications for XCZU1CG-1SFVA625I

  • Description:IC ZUP MPSOC CG A53 FPGA 635BGA
  • Series:Zynq® UltraScale+™ MPSoC CG
  • Mfr:AMD
  • Package:Tray
  • Architecture:MPU, FPGA
  • Core Processor:Dual ARM® Cortex®-A53 MPCore™ with CoreSight™, Dual ARM®Cortex™-R5 with CoreSight™
  • Flash Size:-
  • RAM Size:256KB
  • Peripherals:DMA, WDT
  • Connectivity:-
  • Speed:500MHz, 1.2GHz
  • Primary Attributes:-
  • Operating Temperature:-40°C ~ 100°C (TJ)
  • Package / Case:625-BFBGA, FCBGA
  • Supplier Device Package:625-FCBGA (21x21)

Soc System On Chip datasheet and documents for XCZU1CG-1SFVA625I

XCZU1CG-1SFVA625I

Soc System On Chip Overview

The AMD XCZU1CG-1SFVA625I is a Zynq UltraScale+ MPSoC featuring dual ARM Cortex-A53 application processors and dual ARM Cortex-R5F real-time processors. It integrates 4,680 Adaptive Logic Modules (ALMs) within the programmable logic fabric. The device includes 3.8 Mbit of embedded memory and supports up to 72 I/O pins. Operating at a core voltage of 850 mV, it functions within a temperature range of -40°C to +100°C. The component utilizes a 625-ball FCBGA package for surface-mount installation.

Soc System On Chip Feature Summary

  • Dual-core ARM Cortex-A53 and dual-core ARM Cortex-R5F processing subsystem
  • 4,680 ALMs with 3.8 Mbit embedded memory capacity
  • Industrial temperature rating from -40°C to +100°C
  • 625-ball FCBGA package with 72 available I/Os

Soc System On Chip Applications

  • Sensor processing and fusion systems
  • Motor control applications
  • Low-cost ultrasound imaging devices
  • Traffic engineering infrastructure

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms industrial temperature operation (-40°C to +100°C). Confirm the speed grade '1' matches design timing requirements. Ensure the 625-FCBGA package footprint aligns with PCB layout constraints. Cross-reference the manufacturer datasheet for pinout definitions and power sequencing specifications before integration.

Soc System On Chip Selection Notes

Select this model for designs requiring moderate logic density with dual-core processing capabilities. The CG series targets cost-sensitive applications compared to higher-performance EG or EV variants. Verify that the 4,680 ALM count suffices for the intended hardware acceleration tasks. Check if the 72 I/O limit meets interface requirements for sensors and communication buses.

Soc System On Chip Part Context

This part belongs to the Zynq UltraScale+ MPSoC family, specifically the CG (Dual-Core Application Processor) tier. It shares the same silicon architecture as other CG variants but differs in speed grade, package type, and temperature rating. It serves as an entry-level option for adaptive SoC designs requiring integrated processing and programmability.

Soc System On Chip Replacement Considerations

XCZU1CG-1SFVA625E: Same logic and cores, but commercial temperature range (0°C to 100°C). XCZU1CG-2SFVA625I: Higher speed grade (Grade 2) with identical package and temperature rating.

XCZU1CG-1SFVA625IXCZU1CG-1SFVA625I
$274.04
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