XCZU47DR-2FSVG1517I

Soc System On Chip Overview

The XCZU47DR-2FSVG1517I is an industrial-grade Zynq UltraScale+ RFSoC device from AMD, featuring a heterogeneous architecture that integrates a Processing System (PS), Programmable Logic (PL), and high-speed RF data converters. The PS comprises four ARM Cortex-A53 cores operating up to 1.333 GHz and dual ARM Cortex-R5 cores at 533 MHz. The PL provides over 930K logic cells for hardware acceleration. Key differentiators include eight 14-bit RF ADCs sampling at 5 GSPS and eight 14-bit RF DACs at 9.85 GSPS, enabling direct digitization of RF signals below 6 GHz. It supports DDR4/LPDDR4 memory interfaces and includes integrated SD-FEC hard kernels.

Soc System On Chip Feature Summary

• Integrated RF Data Converters: Eight 14-bit ADCs (5 GSPS) and eight 14-bit DACs (9.85 GSPS) for direct RF sampling.
• Heterogeneous Processing: Quad-core ARM Cortex-A53 (1.333 GHz) and dual-core ARM Cortex-R5 (533 MHz) with CoreSight debug support.
• High-Density FPGA Fabric: Over 930K logic units with DSP48E2 slices for complex signal processing.
• Industrial Reliability: Operates within the -40°C to +100°C temperature range in a 1517-ball FCBGA package.

Soc System On Chip Applications

• Software Defined Radio (SDR) and cognitive radio systems.
• Phased array radar and digital beamforming applications.
• 5G New Radio (NR) baseband processing and small cell infrastructure.
• Satellite communication ground stations and payloads.

Soc System On Chip Procurement Notes

Verify the specific suffix 'I' confirms the industrial temperature rating (-40°C to +100°C). Confirm the package type is 1517-ball FCBGA. Ensure compatibility with the required speed grade '-2'. Check for export control regulations as these devices may be subject to final-use declarations due to their high-performance computing capabilities.

Soc System On Chip Selection Notes

Select this model when direct RF sampling below 6 GHz is required without external mixers. Compare against XCZU48DR if higher DAC rates (10 GSPS) are needed. Verify that the 930K logic resource count meets the design's complexity requirements. Ensure the board design supports the thermal dissipation needs of the FC-BGA package and the power delivery for the multi-voltage domains.

Soc System On Chip Part Context

This component belongs to the third-generation Zynq UltraScale+ RFSoC family. It serves as a single-chip adaptive radio platform, consolidating the entire RF transceiver chain, digital front-end, and application processing into one die. It replaces traditional discrete RF chains involving multiple mixers, filters, and separate ADC/DAC components.

Soc System On Chip Replacement Considerations

For pin-compatible or functional upgrades within the same generation, consider the XCZU48DR-2FSVG1517I which offers enhanced DAC performance. For lower-cost entry points, evaluate the XCZU27DR or XCZU28DR series, noting differences in logic resources and I/O counts.