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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Products in this family are solid-state devices used to connect or interrupt the flow of current to a supported load, under the direction of a logic-level control signal that is of itself incapable or unsuitable for supplying the load. They integrate the semiconductor switching device used to interrupt current flow and incorporate additional supporting components/functions such as over-voltage clamping, current limiting, and under-voltage lockouts, which differentiate them from similar IC and discrete components.
Wilmington, Mass. & Milpitas, Calif. – May 19, 2026 – Analog Devices, Inc. (NASDAQ: ADI), a global leader in high-performance analog and mixed-signal semiconductors,…
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What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
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WILMINGTON, Mass. – August 11, 2026 — Analog Devices, Inc. (NASDAQ: ADI), the global leading supplier of high-performance analog, mixed-signal and digital signal processing…
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Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
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Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
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Embedded Integrated Circuit Modules: The Backbone of Modern Technology Embedded Integrated Circuit Modules (EICMs) have become an indispensable part of modern technology. Serving as…
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In an era dominated by AI accelerators with terabytes of HBM memory and consumer devices racing toward LPDDR5X bandwidth, it’s easy to wonder: why…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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Samsung Electronics, the world’s largest memory chip manufacturer, has officially confirmed the end-of-life (EOL) for its LPDDR4 and LPDDR4X low-power DRAM products, marking a…
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Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
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Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
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