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Fiber optic transceiver modules are fiber cable adaptive housings that contain a light source for transmitting data via fiber optic cable as well as a photodiode for receiving fiber optic data. Mounting options include pluggable CXP, QSFP, SFF, SFP, and XFP, surface or through-hole, CFP, 1x9 SC, and panel. Data rate, wavelength, application and connector type are among the primary selection parameters.
CWDM-SFP-100BASE-1550-150-I-MSA-ATView Product
1005-1321-CView Product
SFP-10G-DZ-1490-CView Product
FTLC1155RGPLDView Product
SFP-10GB-DW61-80-I-C-CView Product
SFP-10GB-DW46-80-CView Product
XBR-8GFC-40KM-3347-CView Product
B-730-0006-055-CView Product
XCVR-S00Z85-CView Product
HFBR-57E0APZ-CView Product
SRX-SFP-10GE-LR-HPCView Product
DWDM-SFP-8G-CH23-80-MSA-ATView Product
Choose a rocker switch by AC/DC ratings, contact arrangement, illumination, panel fit and sealing. Get practical checks for engineering and component sourcing.
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The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
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On October 1, 2025 local time, OpenAI, an artificial intelligence research company, announced the establishment of a cooperative relationship with Samsung Electronics and SK…
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Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
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Tempe, Arizona‑based semiconductor giant Microchip Technology has formally rolled out selective product price increases across its MCU, power‑management IC, memory controller and analog component…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
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The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
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Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
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Munich, Germany – May 26, 2026 – Power semiconductor and automotive chip giant Infineon Technologies AG has formally notified customers worldwide of a second…
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Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
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Over the past week, the global electronic components sector has witnessed dual transformations in policy and technology: Coupled with mounting pressure from a worsening…
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Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
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