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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
![]() LMG3526R030RQSR $23.53 | Texas Instruments | 650-V 30-M GAN FET WITH INTEGRAT | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Wettable Flank | - | ||
![]() LMG3526R030RQST $26.94 | Texas Instruments | 650-V 30-M GAN FET WITH INTEGRAT | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Wettable Flank | - | ||
![]() M63994P $1.92 | Powerex Inc. | HVIC HALF-BRIDGE DVR 8SOP | Bulk | Surface Mount | - | ||
| Infineon Technologies | MODULE GATE DRIVER | Tray | - | - | |||
| Infineon Technologies | MODULE GATE DRIVER | Tray | - | - | |||
| Powerex Inc. | IPM MOD CMPCT DUAL 1200V 200A | Bulk | Chassis Mount | - | |||
| Powerex Inc. | IPM MOD CMPCT DUAL 600V 300A | Bulk | Chassis Mount | - | |||
| Powerex Inc. | IPM MOD CMPCT DUAL 1200V 300A | Bulk | Chassis Mount | - |

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