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— IC芯片 | 连接器 | 传感器 | 被动器件 —
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— IC芯片 | 连接器 | 传感器 | 被动器件 —

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.
| Select products | Mfr | Description | Package | Supplier Device Package | Mounting Type | Series | Operating Temperature |
|---|---|---|---|---|---|---|---|
| IXYS | POWER MODULE | Tray | Surface Mount | - | |||
| IXYS | POWER MODULE H-BRIDGE 15V 10A | Tray | Surface Mount | - | |||
| IXYS | DVR MOD +15V -15V 10A MOLDED | Tray | Surface Mount | - | |||
| IXYS | POWER MODULE | Tray | Surface Mount | - | |||
![]() LMG3522R030QRQSRQ1 $13.21 | Texas Instruments | AUTOMOTIVE 650-V 30-M GAN FET WI | Tape & Reel (TR) | Surface Mount, Wettable Flank | - | ||
![]() LMG3522R030QRQSTQ1 $30.29 | Texas Instruments | AUTOMOTIVE 650-V 30-M GAN FET WI | Tape & Reel (TR),Cut Tape (CT) | Surface Mount, Wettable Flank | - | ||
![]() LMG3522R030RQSR $22.05 | Texas Instruments | 650-V 30-M GAN FET WITH INTEGRAT | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | - | ||
![]() LMG3522R030RQST $25.26 | Texas Instruments | 650-V 30-M GAN FET WITH INTEGRAT | Tape & Reel (TR),Cut Tape (CT) | Surface Mount | - |

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