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1-640384-3 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN HEADER VERT 13POS 3.96MM. Review the specifications below when checking this part for your BOM.
The TE Connectivity AMP Connectors part number 1-640384-3 is a Mass Termination Assembly (MTA) header connector belonging to the MTA-156 series. It features a vertical, single-row configuration with three positions and a 3.96mm (0.156 inch) contact centerline spacing. Designed for wire-to-board applications, this component utilizes insulation displacement contacts (IDC) for termination. The connector is constructed with copper alloy contacts and a thermoplastic insulator, rated for operation within a temperature range of -55°C to +105°C.
Verify the specific suffix against official TE Connectivity documentation to confirm exact packaging and material specifications. Ensure compatibility with mating receptacles from the same MTA-156 family. Confirm that the IDC termination method aligns with available assembly tooling and wire gauge requirements for the intended application.
Select this component when a low-profile, vertically mounted header is required for IDC termination. The 3.96mm pitch allows for higher density compared to standard 2.54mm headers. Consider the operating temperature range and current rating constraints relative to the connected wiring harness and environmental conditions during system design.
This connector is part of the broader MTA (Mass Termination Assembly) product line by TE Connectivity AMP Connectors. The MTA series is engineered for efficient mass termination processes, offering reliable electrical performance in compact form factors. It represents a standard solution for connecting wires directly to printed circuit boards without individual crimping or soldering of each pin.
Compatible replacements must match the 3.96mm pitch, 3-position count, and vertical header orientation. Verify that substitute components support identical IDC termination mechanisms and fit within the same mechanical envelope to ensure proper board integration.
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