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1-87224-1 is listed in the Headers, Male Pins range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is CONN HEADER VERT 11POS 2.54MM. Review the specifications below when checking this part for your BOM.
The 1-87224-1 is a vertical board-to-board and wire-to-board header from the AMPMODU MOD II series by TE Connectivity. It features an 11-position single row configuration with a 2.54mm (0.100 inch) contact pitch. The connector utilizes through-hole termination for secure PCB mounting and employs gold-plated copper alloy contacts to ensure reliable signal transmission. Designed as an unshrouded, non-polarized component, it operates within a standard temperature range suitable for general electronic applications.
Verify that the specific order matches the 11-position variant, as the base part number covers multiple pin counts. Confirm RoHS compliance status if restricted substances are required. Ensure the procurement channel sources genuine TE Connectivity products to guarantee material integrity and long-term reliability in final assemblies.
Select this component when a vertical, unshrouded header with a 2.54mm pitch is required. The 11-pin count distinguishes it from other positions in the AMPMODU family. Verify mating socket compatibility and ensure the through-hole footprint aligns with the PCB design constraints before finalizing the bill of materials.
This component belongs to the AMPMODU MOD II series, a widely used line of rectangular connectors known for versatility. It serves as a male header counterpart to various receptacles within the same ecosystem. The series supports both board-to-board and wire-to-board connections, offering a standardized solution for diverse interconnection needs across multiple industries.
Compatible substitutes include other 11-position, 2.54mm pitch vertical headers from different manufacturers. Ensure identical pin count, pitch, and termination method when evaluating alternatives to maintain mechanical fit and electrical performance without redesigning the host assembly.
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