10-88-1501

Headers, Male Pins Overview

The Molex 10-88-1501 is a C-Grid® Breakaway Header featuring dual rows and straight orientation. It contains 50 circuits with male gender contacts. The component utilizes tin plating on both mating and termination interfaces. Designed for through-hole mounting, it supports solder pin termination styles. This specific part number is officially classified as obsolete within the manufacturer's product portfolio.

Headers, Male Pins Feature Summary

• Dual row configuration for high-density circuit connections
• Breakaway design allows for flexible panel or board sizing
• Tin-plated contacts ensure reliable electrical performance

Headers, Male Pins Applications

• General electronic interconnect systems
• Industrial control boards
• Consumer electronics assemblies

Headers, Male Pins Procurement Notes

Verify current availability status as this part is marked obsolete. Source replacement components from authorized distributors only. Confirm that substitute headers match the original pitch and contact count requirements. Ensure new selections maintain compatible termination and housing specifications for existing designs.

Headers, Male Pins Selection Notes

Evaluate alternative C-Grid® headers with identical 2.54mm spacing and 50-circuit capacity. Consider right-angle variants if spatial constraints require different mounting orientations. Verify that replacement materials meet the same thermal and mechanical standards required by the original application environment.

Headers, Male Pins Part Context

This component belongs to the Molex C-Grid® family of breakaway headers. These connectors are engineered for versatile PCB applications requiring robust signal transmission. The series offers modular solutions adaptable to various industry standards and environmental conditions.

Headers, Male Pins Replacement Considerations

Identify equivalent parts with matching 2.54mm pitch and dual-row layout. Cross-reference similar 50-position male headers from the same manufacturer series. Validate physical dimensions and terminal compatibility before integration.