1N4693E3/TR

Overview

The 1N4693E3/TR is a single Zener diode manufactured by Microchip Technology, designed for voltage regulation applications. It features a nominal Zener voltage of 7.5 V with a tolerance of ±5%. The device has a power dissipation rating of 500 mW and operates within a temperature range of -65°C to +175°C. Key electrical parameters include a maximum reverse leakage current of 10 µA and a forward voltage of 1.1 V at 200 mA. It is housed in a DO-35-2 through-hole package and supplied in a reel.

Feature Summary

• Provides stable voltage reference and regulation at 7.5V
• Capable of handling high operating temperatures up to 175°C
• Low reverse leakage current for efficient performance

Applications

• Voltage regulation circuits
• Voltage reference sources
• Overvoltage protection

Procurement Notes

Verify the specific suffix E3/TR against official Microchip documentation to confirm RoHS compliance and tape-and-reel packaging format. Ensure the DO-35-2 package dimensions match your PCB layout requirements. Cross-reference the 7.5V Zener voltage and 500mW power rating with your circuit design specifications before finalizing procurement orders.

Selection Notes

Select this component when a precise 7.5V reference is required in through-hole designs. Consider the ±5% tolerance and 500mW power limit for thermal management. The wide operating temperature range makes it suitable for industrial environments. Verify that the 10µA leakage current meets the sensitivity requirements of the connected circuitry.

Part Context

This part belongs to the 1N469x series of Zener diodes from Microchip Technology. These components are standard voltage regulator diodes commonly used in electronic circuits requiring stable voltage levels. The E3 suffix typically indicates environmental compliance, while TR denotes reel packaging for automated assembly processes.

Replacement Considerations

Check for direct substitutes with identical 7.5V Zener voltage, 500mW power rating, and DO-35 package. Ensure compatibility with existing PCB footprints and thermal constraints when evaluating alternative manufacturers or updated revisions.