1N4693UR-1/TR

Single Zener Diodes Overview

The Microchip Technology 1N4693UR-1/TR is a 0.5 W surface mount Zener diode in the DO-213AA package. It features a nominal voltage of 7.5 V with a standard tolerance of ±5%. The device operates within a temperature range of -65 °C to +175 °C and utilizes a metallurgically bonded internal construction for high reliability.

Single Zener Diodes Feature Summary

• Hermetically sealed glass DO-213AA MELF style package
• Internal metallurgical bond between metal slugs and silicon die
• Up-screening available in reference to MIL-PRF-19500

Single Zener Diodes Applications

• Voltage regulation over broad operating current and temperature ranges
• High-reliability electronic circuits requiring radiation hardness
• Surface mount equivalents for JEDEC registered series

Single Zener Diodes Procurement Notes

Verify the specific suffix configuration against official documentation, as ordering codes determine RoHS compliance and tolerance levels. Confirm availability of up-screened versions if military or aerospace standards are required. Ensure the tape and reel packaging matches the TR designation in the part number.

Single Zener Diodes Selection Notes

Select this component for applications requiring a 7.5 V reference in a compact surface mount form factor. Consider the low test current of 50 µA for low-power designs. Evaluate thermal resistance values when designing heat dissipation on FR4 PCBs to ensure operation remains within the specified junction temperature limits.

Single Zener Diodes Part Context

This device belongs to the 1N4678UR-1 through 1N4717UR-1 series of 0.5 W Zener diodes. The series provides voltage options from 1.8 V to 43 V. The UR-1 designation indicates a metallurgically bonded surface mount package, while the TR suffix specifies tape and reel packaging.

Single Zener Diodes Replacement Considerations

Direct replacements include other manufacturers' DO-213AA Zener diodes with matching 7.5 V ratings and 0.5 W power dissipation. Verify that substitute components meet the same hermetic sealing and metallurgical bonding requirements for equivalent reliability.