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1N4697 TR PBFREE is listed in the Single Zener Diodes range at ChipApex. The manufacturer field lists Central Semiconductor Corp. Its product description is 10V 500MW TH DIODE-ZENER SINGLE:. Review the specifications below when checking this part for your BOM.
The Central Semiconductor Corp 1N4697 TR PBFREE is a single Zener diode designed for voltage regulation applications. It features a nominal Zener voltage of 10 V with a tolerance of 5%. The device has a maximum power dissipation of 500 mW and operates within a temperature range of -65°C to +200°C. Key electrical characteristics include a maximum reverse leakage current of 1 uA and a test current of 50 uA. The component is housed in a DO-35 axial through-hole package, suitable for standard PCB mounting.
Verify the specific suffix 'TR' against official datasheets, as the standard 1N4697 is typically available in bulk or cut tape rather than reel packaging. Confirm RoHS compliance status directly with the manufacturer, as historical data indicates variations. Ensure the DO-35 package dimensions match your board layout requirements before finalizing procurement.
Select this component when a robust, high-temperature Zener diode is required for through-hole assembly. The 500 mW power rating allows for moderate current handling compared to lower-power surface mount alternatives. Consider the 5% voltage tolerance for precision requirements and verify that the axial lead form factor fits the intended mechanical constraints.
This part belongs to the standard 1N46xx series of glass-passivated Zener diodes manufactured by Central Semiconductor. These devices are widely used in general-purpose electronics for voltage stabilization. The 1N4697 specifically targets the 10 V regulation niche within this extensive product line, offering reliability in harsh environments due to its wide operating temperature range.
Direct substitutes include other manufacturers' 1N4697 variants such as those from onsemi or GE. Surface-mount equivalents like the BZX84C10 may be considered if board space permits a package change, though thermal and mechanical mounting differences must be evaluated.
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