1N4709UR-1

Overview

The 1N4709UR-1 is a single Zener diode manufactured by Microchip Technology, designed for surface mount applications. It features a DO-213AA (SOD-80/MELF-2) package and provides a nominal Zener voltage of 24 V with a tolerance of ±5%. The device has a power dissipation rating of 500 mW and operates as a unidirectional silicon component. It is classified under Diodes & Rectifiers and is suitable for voltage regulation tasks in compact electronic circuits.

Feature Summary

• Surface mount construction in a hermetically sealed glass MELF package
• Provides stable voltage regulation at 24 V nominal level
• Designed for high-reliability applications requiring unidirectional operation

Applications

• Voltage regulation in precision analog circuits
• Overvoltage protection for sensitive semiconductor components
• Reference voltage sources in measurement instrumentation

Procurement Notes

Verify RoHS compliance status, as documentation indicates non-compliance for this specific suffix. Confirm the manufacturer origin, noting historical transitions between Microsemi and Microchip Technology. Ensure the DO-213AA package footprint matches the design requirements before procurement.

Selection Notes

Select this component when a 24 V Zener reference is required in a small form factor. The 500 mW power rating supports moderate current loads. Consider the ±5% tolerance for applications requiring tighter voltage accuracy, or verify if the hermetic seal is necessary for environmental durability.

Part Context

This part belongs to the 1N47xx series of Zener diodes, adapted for surface mount technology. The UR-1 suffix typically denotes the specific MELF package variant. These devices are widely used in industrial and commercial electronics where space constraints and reliability are critical factors in circuit design.

Replacement Considerations

Cross-reference with other 24 V Zener diodes in the DO-213AA package. Verify that substitute parts match the 500 mW power rating and ±5% tolerance. Ensure compatibility with existing PCB footprints and thermal management requirements.