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1N4942GP-AP is listed in the Single Diodes range at ChipApex. The manufacturer field lists MCC (Micro Commercial Components). Its product description is DIODE STANDARD 200V 1A DO41. Review the specifications below when checking this part for your BOM.
The MCC 1N4942GP-AP is a glass passivated junction fast switching rectifier diode designed for general-purpose applications. It features a maximum average forward current of 1.0 A and a maximum repetitive peak reverse voltage of 200 V. The device utilizes a DO-41 plastic package with axial leads, offering low leakage current and high surge capability. It operates within a junction temperature range of -55°C to +150°C and meets UL 94 V-0 flammability ratings.
Verify the specific suffix configuration when ordering, as the AP designation indicates Ammo Packing containing 5,000 pieces per box. Confirm RoHS compliance status based on the GP suffix, which designates lead-free finish. Ensure procurement channels are authorized distributors to guarantee genuine parts with full traceability and adherence to MCC quality standards.
Select this component for circuits requiring a 200 V reverse voltage rating and 1 A continuous forward current. Consider the DO-41 package for through-hole mounting requirements. Evaluate the thermal resistance specifications against the expected ambient operating conditions to ensure the junction temperature remains within the specified -55°C to +150°C operational range during continuous operation.
This part belongs to the 1N4942GP through 1N4948GP series manufactured by Micro Commercial Components. The series shares identical physical dimensions and electrical characteristics regarding current handling, differing only in their maximum repetitive peak reverse voltage ratings. The 1N4942 variant specifically provides the lowest voltage threshold within this family at 200 V.
Compatible substitutes include other manufacturers' 1N4942 rectifiers meeting the same 200 V and 1 A specifications. Verify that replacement components maintain equivalent DO-41 package dimensions and thermal resistance values to ensure mechanical fit and thermal performance compatibility in existing designs.
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