SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 20110103 is a universal telescopic slide designed for 19-inch rack mounting. It features a slim profile with a rack height of 2U and an extension length of 457 mm. The component provides full 100% extension capability, allowing complete access to mounted equipment. It supports a maximum load capacity of 61 kg. The unit originates from Germany and has a gross weight of approximately 2112 grams including packaging.
Verify the specific part number format, as sources list both 20110103 and 20110-103. Confirm manufacturer attribution to nVent Schroff or Schroff GmbH. Ensure compatibility with 19-inch mounting standards before purchase. Check origin details if regional compliance is required.
Select this model when full extension is necessary for maintenance or cabling access. The 61 kg load rating suits heavier equipment than standard slides. The 2U height constraint requires verification against available rack space. Universal mounting simplifies integration into existing 19-inch infrastructure without custom adapters.
This component belongs to the nVent Schroff telescopic slide series, which specializes in electronics packaging solutions. The product line focuses on high-quality standard products for rack accessories. Schroff is recognized for innovative designs in electronic enclosure systems and bus specifications.
No public confirmed substitute part numbers are available in the provided documentation. Verify dimensional compatibility with existing rack structures before considering alternative models.

Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read More
Monolithic Power Systems (MPS), a global leader in analog and mixed-signal semiconductors, has notified its distribution partners of an upcoming price increase for selected…
Read MoreRecently, global semiconductor manufacturers have been constantly making moves in aspects such as technological cooperation, product manufacturing processes, and market layout, demonstrating the rapid…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
The global electronics industry is facing an escalating shortage of tantalum capacitors, a critical passive component, as surging demand from AI servers, automotive electronics,…
Read More
The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More