SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 20130059 is a DIN rail mounting bracket designed for securing electronic components within industrial control enclosures. It provides a standardized interface for attaching devices to standard 35mm DIN rails, ensuring stable mechanical support and alignment. The component facilitates organized cable management and device positioning in compact panel layouts.
Verify the specific mounting configuration and material specifications against the official Schroff datasheet for part number 20130059. Confirm compatibility with the target 35mm DIN rail standard and ensure the component meets the required environmental ratings for the intended installation environment before procurement.
Select this bracket when a dedicated mounting solution is required for DIN rail-mounted devices that lack integrated rail clips or require additional stabilization. Ensure the physical dimensions of the target device are compatible with the bracket's footprint and that the enclosure layout allows for proper rail access.
This component belongs to the Schroff range of enclosure accessories and mounting hardware. It is designed to complement DIN rail-mounted power supplies, controllers, and signal conditioners, providing a robust structural element for industrial electrical installations requiring reliable component fixation.
Check for equivalent DIN rail brackets from other manufacturers such as Phoenix Contact or Wago that match the 35mm rail standard and similar mounting geometry. Verify dimensional compatibility and load-bearing requirements before substituting.

Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read More
Recently, a survey by the Electronic Components Industry Association (ECIA) revealed that the sales sentiment of global electronic components remained optimistic in the third…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
TOKYO, April 1, 2026 – Kioxia Corporation (formerly Toshiba Memory Corporation), a global leader in flash memory and storage solutions, has officially issued a…
Read MoreMay 8, 2026 – Eindhoven, Netherlands NXP Semiconductors (NXPI), a global leader in automotive and industrial semiconductor solutions, has officially notified its worldwide channel…
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Stay ahead with ChipApex Insights — technical deep dives, market trends, and sourcing tips for memory, microcontrollers, power management, and industrial-grade components. Trusted by…
Read More
If you’ve spent any time staring at a schematic, you’ve seen the triangle. Two inputs, one output, and a gain symbol that looks deceptively…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Manchester, New Hampshire, USA – March 22, 2026 – Allegro MicroSystems, Inc. (Nasdaq: ALGM), a global leader in high-performance power and sensing semiconductor solutions…
Read More