SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 20130616 is a heavy-duty VARISTAR cabinet frame designed for seismic applications. It features a height of 1200mm, width of 800mm, and depth of 800mm. This structural component provides robust support for electronics packaging within industrial environments requiring enhanced stability against seismic activity.
Verify the specific dimensional requirements (1200H x 800W x 800D) against your cabinet layout before ordering. Confirm that the seismic rating meets local regulatory standards for your installation site. Check manufacturer documentation for any required accessories or mounting hardware not included with the frame unit itself.
Select this model when standard frames do not meet seismic safety requirements. Ensure the 800mm depth accommodates your equipment depth plus necessary rear clearance. Verify that the 1200mm height aligns with your system's vertical space constraints and available cabinet units.
This part belongs to the nVent SCHROFF VARISTAR line, a recognized series for electronics packaging solutions. The product falls under rack accessories, specifically frames, which serve as the foundational structure for assembling electronic enclosures and subracks in industrial settings.
No public confirmed substitute part numbers are available in the provided documentation. Consult nVent SCHROFF technical support for equivalent seismic-rated frames with compatible dimensions if this specific model is discontinued.

PLANO, Texas – March 20, 2026 – Diodes Incorporated (Nasdaq: DIOD), a leading global manufacturer and supplier of high-quality application-specific standard products in the…
Read MoreNXP Semiconductors (NASDAQ: NXPI), a global leader in automotive, industrial, and IoT semiconductors, has officially notified customers of an upcoming price adjustment for select…
Read More
Compare RC, crystal and MEMS oscillator circuits. Check ppm, jitter, load capacitance, startup margin and output compatibility before choosing a clock source.
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
Find out when a bare shock switch needs a pull resistor, when an MCU internal pull-up is enough, and why sensor modules and piezo…
Read More
See when an inductor behaves linearly, how DC bias and saturation reduce inductance, and which current and temperature curves to check.
Read More
ChipApex – May 8, 2026 Texas Instruments (TI), the global leader in analog and embedded semiconductors, has officially notified customers of an upcoming company-wide…
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreTOKYO, July 31, 2026 — Renesas Electronics Corporation has officially announced a major domestic manufacturing restructuring, confirming plans to gradually discontinue all wafer fabrication…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More
Learn what a battery BMS does, how protection differs from charging, and which pack specifications to check when sourcing BMS components through ChipApex.
Read More
Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More