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20790-060E-02 is listed in the Headers, Receptacles, Female Sockets range at ChipApex. The manufacturer field lists I-PEX. Its product description is CABLINE-CA II PLUS RECEPTACLE 60. Review the specifications below when checking this part for your BOM.
The I-PEX 20790-060E-02 is a CABLINE®-CA II PLUS series micro-coaxial connector with a 0.4 mm pitch and 60 contacts. It features a maximum mated height of 0.95 mm, designed for high-density space-constrained applications. This component supports high-speed data transmission protocols including USB4, Thunderbolt 3, eDP HBR3, and PCIe Gen 3/4. Utilizing ZenShield® EMI shielding technology, it ensures signal integrity by reducing electromagnetic noise and crosstalk in compact electronic systems.
Verify the specific part number against official I-PEX documentation to confirm pin configuration and mating compatibility. Ensure that the selected variant meets the required signal integrity specifications for the intended high-speed application. Cross-reference mechanical dimensions with PCB layout constraints to guarantee proper fitment and assembly reliability.
Select this connector when space optimization is critical alongside high-frequency performance requirements. The low profile and high contact density make it suitable for modern portable devices. Consider the flexibility of the attached cable assembly if routing around obstacles or connecting moving components is necessary for the specific device architecture.
This component belongs to the CABLINE® series, which specializes in micro-coaxial solutions for high-speed data transfer. The series is engineered to maintain signal fidelity in environments prone to electromagnetic interference. It complements I-PEX's portfolio of ultra-precision connectors used in consumer electronics and advanced medical instrumentation.
Consult official I-PEX substitution guides for compatible alternatives. Verify that any substitute maintains identical pitch, contact count, and shielding characteristics to ensure seamless integration without redesigning the host circuit board.
It employs ZenShield® EMI shielding technology to minimize electromagnetic interference and crosstalk during high-speed data transmission.
Yes, its flexible micro-coaxial design allows it to be bundled and routed effectively in narrow spaces with moving components.
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