SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF 20818022 is a plug-in unit kit designed for VME subrack modules, featuring an unshielded front panel. It measures 128.4 x 40.3 mm and includes a static trapeziform handle in grey. The unit consists of a pre-anodized front panel and a chromated or passivated rear section. This component serves as a flat front panel for subrack applications, providing a convenient interface for module extraction and installation within standard rack systems.
Verify current availability status as the product may be discontinued but remain in stock through authorized distributors. Confirm compatibility with specific VME subrack dimensions before procurement. Ensure the unshielded configuration meets system requirements. Check for alternative part numbers if new manufacturing is unavailable. Validate technical specifications against original design documents to ensure proper fit and function.
Select this unit when an unshielded front panel is required for VME subracks. The static handle design suits applications not requiring powered extraction mechanisms. Consider the specific dimensional constraints of 128.4 x 40.3 mm. Evaluate shielding needs; this model lacks electromagnetic shielding. Verify that the grey color and trapeziform handle style align with system aesthetics and operational preferences.
This component belongs to the nVent SCHROFF 20818 series, which provides front panels for subrack modules. The series offers various configurations for different module types. The 20818022 specifically addresses unshielded applications with a static handle. It complements other rack accessories by providing standardized front interfaces for electronic assemblies within industrial and telecommunications environments.
Check for direct substitutes within the 20818 series if this specific number is unavailable. Verify dimensional equivalence for 128.4 x 40.3 mm mounting. Ensure the replacement maintains the unshielded characteristic and static handle functionality. Consult manufacturer documentation for cross-reference lists to identify compatible alternatives.

In the world of embedded electronics, getting a device to “think” is only half the battle. The other half is getting it to communicate…
Read More
Learn how a diode conducts, how to identify anode and cathode, and when to choose rectifier, TVS, Zener or photodiode types for a circuit.
Read More
Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read More
Learn why PTC resistance rises with temperature, how it differs from NTC, and which ratings matter for sensing and protection.
Read More
Tokyo / Munich / Tessenderlo, December 24, 2025As the global semiconductor industry enters the first year of the 2nm process era, international electronic component…
Read More
Select a bridge rectifier by reverse voltage, capacitor charging current, startup surge and cooling. Work through a stated DC voltage and ripple example.
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More
The global memory market is entering an unprecedented supply-constrained phase as soaring demand from artificial intelligence (AI) infrastructure collides with strategic capacity reallocations by…
Read More