SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 20849270 is a single full-size Advanced Mezzanine Card (AMC) module mechanism constructed from aluminum. Designed for integration with MicroTCA chassis and AdvancedMC carriers, this accessory features an integrated pull handle for ease of installation and removal. The unit measures 29 x 13 x 73.8 mm, providing a standardized mechanical interface for high-density electronic packaging applications requiring robust structural support.
Verify the specific revision code, such as AMC.0 R2.0, against your system requirements before procurement. Confirm that the single full-size form factor aligns with your chassis slot dimensions. Ensure compatibility with existing AdvancedMC carrier interfaces to prevent mechanical interference during assembly.
Select this component when a dedicated mechanical module for Advanced Mezzanine Cards is required within a MicroTCA environment. The aluminum construction offers a balance of weight and rigidity suitable for rack-mounted systems. Consider the integrated pull handle if frequent maintenance or card replacement is anticipated in the deployment scenario.
This part belongs to the nVent SCHROFF range of rack accessories, specializing in electronics packaging design. It serves as a mechanical interface solution rather than an active electronic component. The product line focuses on standard products for industrial and telecommunications infrastructure, ensuring reliable physical connectivity for mezzanine card architectures.
Cross-reference with other single full-size AMC modules from the same manufacturer family. Verify dimensional compatibility, specifically the 29 x 13 x 73.8 mm footprint, before substituting with alternative suppliers.

Selecting the right microcontroller (MCU) isn’t just about specs—it’s about balancing performance, power, cost, and supply chain reliability. As an engineer, you’ve probably faced…
Read More
Recently, the global electronic components market has been constantly evolving, and different regions and enterprises have witnessed new moves in aspects such as technological…
Read More
Choose an AC to DC converter by input range, output demand, isolation, efficiency and thermal derating. Compare architectures and check installation needs.
Read More
Compare Pt100 and Pt1000 RTDs, two-, three- and four-wire connections, excitation and self-heating. Build an error budget from element to reported temperature.
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Munich, Germany – February 8, 2026 — Infineon Technologies, the German semiconductor giant, officially issued a price increase notice on February 5, announcing that…
Read More
Choose a DIP switch by contact type, coded positions, footprint and signal ratings. Check logic polarity, assembly conditions and PCB configuration behavior.
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read MoreSANTA CLARA, Calif. — Leading semiconductor solution provider Marvell Technology (NASDAQ: MRVL) officially rolled out a selective price adjustment for its core electronic component…
Read More
Understand tactile switches, PCB and keyboard differences, four-pin wiring, debounce, force, travel and replacement checks for reliable control inputs.
Read MoreLas Vegas, January 6, 2026 — At the Consumer Electronics Show (CES) 2026, Texas Instruments (TI) (NASDAQ: TXN) announced a suite of next-generation semiconductor…
Read MoreThe Dutch government’s intervention in the control of Nexperia (Anshi Semiconductor) is triggering a chain reaction of turmoil in the global power semiconductor market.…
Read More