SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The nVent SCHROFF part number 21100671 is a pivot pin designed for use with 19-inch chassis systems. Constructed from stainless steel, this hardware component adheres to DIN 7 specifications. It serves as a mechanical connector intended for insertion into circuit board holes, facilitating the attachment of handles to PCB assemblies. The item is supplied in packages containing two pieces.
Verify the specific application context before purchase, as this component is strictly a mechanical pivot pin for chassis and PCB handle integration. Confirm compatibility with existing DIN 7 standards and 19-inch chassis requirements. Ensure the stainless steel construction meets environmental durability needs. Check package quantity details against project requirements. Cross-reference with official nVent SCHROFF documentation to confirm exact dimensional tolerances and material grades.
Select this component when a dedicated pivot mechanism is required for attaching handles to printed circuit boards within a 19-inch chassis framework. The stainless steel composition ensures corrosion resistance and mechanical stability. Consider the DIN 7 specification compliance for standardization. Evaluate the need for pre-packaged quantities of two units per set. This part is suitable for structural hardware roles rather than electrical connectivity.
This component belongs to the nVent SCHROFF series of box accessories and hardware. It is categorized specifically as a pivot pin used in enclosure and chassis assembly contexts. The product line focuses on mechanical support and connection solutions for industrial electronics enclosures. Related items in the series may include label kits or other mounting clips designed for similar chassis environments.
No public confirmed substitute part numbers are available in the provided documentation. Verify compatibility with existing chassis designs before attempting substitution.

Date: May 13, 2026 The global memory industry is facing an unprecedented supply crunch in legacy MLC NAND Flash. Leading manufacturers including Samsung Electronics…
Read More
Geneva, Switzerland – August 20, 2026 – Global leading semiconductor manufacturer STMicroelectronics (ST) has officially issued a new global price adjustment notice to global…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
Compare thermistors, RTDs, thermocouples and temperature ICs. Learn how range, accuracy, response, interfaces and mounting affect component selection.
Read More
Select MOV varistors by continuous voltage, clamping behavior, surge waveform and repetition. Check thermal disconnection, fuse coordination and replacements.
Read More
TOKYO — Global leading semiconductor and power electronic components manufacturer Renesas Electronics officially issued a new price adjustment notice in early September 2026, confirming…
Read More
Hsinchu, Taiwan – April 18, 2026 – United Microelectronics Corporation (UMC, NYSE: UMC), a leading global semiconductor foundry specializing in mature process technologies, has…
Read More
Understand thermal fuse operation, Tf, Th and Tm, electrical ratings and mounting. Check temperature limits and replacement requirements for your design.
Read MoreLatest updates from leading semiconductor manufacturers: Wolfspeed launches new SiC modules, AMD reveals MI430X with HBM4, TSMC eyes third Japan fab, and Samsung samples…
Read MoreAs 2025 draws to a close, the global semiconductor industry stands at a crossroads. Intertwined with escalating geopolitical tensions, supply chain disruptions, and groundbreaking…
Read More
Understand how oscillators generate timing signals, how they differ from crystals, and which frequency, output and stability specs matter when choosing one.
Read More
A perfect storm of surging demand and supply chain disruptions is roiling the global electronic components market, with advanced semiconductors and critical materials now…
Read More