SEARCH
— IC芯片 | 连接器 | 传感器 | 被动器件 —
The Schroff 21130263 is a top cover vent designed for rack mounting systems. It features a flat, perforated steel construction finished in gray-black color to facilitate airflow and thermal management within electronic enclosures. The component measures 600 mm in width and 800 mm in depth, providing standardized coverage for compatible rack frames. This accessory ensures proper ventilation while maintaining the structural integrity of the equipment housing.
Verify RoHS compliance status before procurement as sources indicate compliance. Confirm current availability as some distributors list this item as discontinued or out of stock. Check for alternative part numbers if original manufacturing has ceased. Ensure dimensional compatibility with existing rack structures prior to ordering.
Select this component based on specific rack width and depth requirements matching the 600x800mm footprint. Consider the material durability and corrosion resistance provided by the steel construction. Evaluate the ventilation density against thermal load requirements of the enclosed electronics. Verify mounting interface compatibility with the specific rack series in use.
This part belongs to the nVent Schroff range of rack accessories and packaging solutions. Schroff specializes in electronics packaging, offering standard products for industrial applications. The 21130263 serves as a functional component within larger rack assembly systems, contributing to environmental protection and thermal regulation of sensitive electronic hardware.
OnlineComponents.com indicates this product is discontinued but suggests alternatives may exist. Verify exact dimensional matches when sourcing substitutes. Ensure replacement parts maintain similar ventilation characteristics and mounting standards.

The rapid advancement of artificial intelligence (AI) is transforming industries across the globe, and the world of electronic components is no exception. From smarter…
Read More
The multilayer ceramic capacitor (MLCC) market has fallen into a severe structural supply crunch in the third quarter of 2026, driven by explosive demand…
Read More
Learn the relay definition, coil and contact operation, NO and NC forms, load ratings and suppression choices. Compare mechanical, reed and solid-state types.
Read MoreRecently, global semiconductor manufacturers have been constantly taking actions and presenting numerous new developments in aspects such as process technology and product research and…
Read More
What Is NAND Flash? A Practical Guide for Engineers & Procurement Teams In today’s data-driven world—from smartphones and SSDs to industrial IoT devices—NAND flash…
Read More
Every audio power amplifier design starts with the same fundamental challenge: converting a low-voltage line-level signal into the high-current drive required by a reactive…
Read More
WILMINGTON, Mass. – July 3, 2026 – Analog Devices, Inc. (ADI), the global leading supplier of high-performance analog, mixed-signal and signal processing semiconductors, has…
Read More
As the backbone of modern technology, electronic components are undergoing revolutionary changes, driven by advancements in materials science, miniaturization, and smart manufacturing. From ultra-efficient…
Read More
Recently, the global electronic component market has witnessed a series of new developments. The strategic layouts and market collaborations of major enterprises are constantly…
Read More
Learn how a pressure transducer converts pressure into voltage, current, or digital output, and compare pressure references and key selection specs.
Read More
Learn what an IMU measures, how accelerometers and gyroscopes work together, why orientation estimates drift, and what to compare.
Read More
Choose logic inverter ICs by thresholds, supply, output drive and delay. Compare standard and Schmitt-trigger inputs, power sequencing and replacement checks.
Read More