2344054-1

$2.48

Description：PCIRELAND GEN3.0 SMT TYPE CONNEC
Series：-
Mfr：TE Connectivity AMP Connectors
Package：Tape & Reel (TR)

SKU:ba7422debbc9 Category: Edgeboard Connectors Brand: TE Connectivity AMP Connectors

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Product introduction

2344054-1 is listed in the Edgeboard Connectors range at ChipApex. The manufacturer field lists TE Connectivity AMP Connectors. Its product description is PCIRELAND GEN3.0 SMT TYPE CONNEC. Review the specifications below when checking this part for your BOM.

Edgeboard Connectors specifications for 2344054-1

Description：PCIRELAND GEN3.0 SMT TYPE CONNEC
Series：-
Mfr：TE Connectivity AMP Connectors
Package：Tape & Reel (TR)
Card Type：PCI Express™
Gender：Female
Number of Positions/Bay/Row：11; 7
Number of Positions：36
Card Thickness：0.062" (1.57mm)
Number of Rows：2
Pitch：0.039" (1.00mm)
Read Out：Dual
Features：Board Guide, Locking Ramp, Solder Retention
Mounting Type：Surface Mount
Termination：Solder
Contact Material：Phosphor Bronze
Contact Finish：Gold
Contact Finish Thickness：15.0µin (0.38µm)
Contact Type：Cantilever
Color：Black
Flange Feature：-
Operating Temperature：-40°C ~ 85°C

Edgeboard Connectors datasheet and documents for 2344054-1

2344054-1

Edgeboard Connectors Overview

The 2344054-1 is a PCI Express Gen 3.0 connector manufactured by TE Connectivity AMP Connectors. It features a surface-mount technology (SMT) design with 36 positions configured for female contacts. The component utilizes gold-plated terminals to ensure reliable signal integrity and includes a 0.039-inch (1.00mm) pitch spacing between contact rows. Designed for high-speed data transmission applications, this black-colored connector is engineered for direct integration onto printed circuit boards.

Edgeboard Connectors Feature Summary

Surface-mount construction for automated PCB assembly
Gold-plated female contacts for enhanced conductivity
PCI Express Gen 3.0 compliant interface standard

Edgeboard Connectors Applications

High-performance computing motherboards
Graphics processing unit expansion slots
Server backplane interconnects

Edgeboard Connectors Procurement Notes

Verify the specific manufacturing lot and compliance documentation against current project requirements before procurement. Confirm that the surface-mount footprint matches the intended PCB layout exactly. Ensure that the supplier provides valid traceability records for the gold plating thickness and material composition to maintain signal integrity standards in high-frequency operations.

Edgeboard Connectors Selection Notes

Select this component when a low-profile, high-density connection is required for PCIe Gen 3.0 interfaces. The SMT format eliminates the need for through-hole drilling, reducing board stress. Verify that the 1.00mm pitch aligns with the mating card edge dimensions. Consider thermal management capabilities during system integration due to the dense pin configuration.

Edgeboard Connectors Part Context

This part belongs to the broader family of high-speed interconnect solutions designed for modern electronic systems. It represents a transition toward compact, high-bandwidth connectivity options that support evolving data transfer speeds. The component integrates into larger subsystems requiring robust electrical connections within constrained physical spaces.