2358256-1

Edgeboard Connectors Overview

The TE Connectivity AMP Connectors part number 2358256-1 is a standard card edge connector belonging to the SBCE series. It features a dual-row configuration with 50 positions and a 2.54 mm (0.100 inch) centerline pitch. Designed for through-hole PCB mounting, this component utilizes gold-plated copper alloy contacts to ensure reliable signal transmission. The housing is constructed from thermoplastic material, supporting operation within a temperature range of -55°C to +105°C. Rated for 100 V and 9.3 A, it serves as a robust board-to-board interconnection solution.

Edgeboard Connectors Feature Summary

• Dual-row architecture providing 50 contact positions for high-density interconnects
• Gold-plated cantilever spring contacts ensuring low resistance and durability
• Through-hole termination method compatible with standard PCB assembly processes
• Thermoplastic housing designed for stable mechanical performance across wide temperatures

Edgeboard Connectors Applications

• High-density board-to-board connections in industrial control systems
• Signal and power distribution in telecommunications equipment
• Interfacing between daughterboards and motherboards in computing hardware
• Automotive electronic modules requiring reliable thermal stability

Edgeboard Connectors Procurement Notes

Verify that the replacement component matches the original SBCE series specifications, specifically the 2x25 position layout and 2.54 mm pitch. Confirm that the through-hole termination type aligns with existing PCB fabrication capabilities. Ensure the thermoplastic housing material meets the required environmental operating conditions. Cross-reference the manufacturer's current product status to confirm availability and compliance with relevant regulatory standards before finalizing procurement orders.

Edgeboard Connectors Selection Notes

Select this connector when a dual-row interface with 50 positions is required for compact board stacking. The 2.54 mm pitch offers a balance between density and manufacturability. Gold plating on copper alloy contacts is suitable for applications demanding consistent electrical performance over repeated mating cycles. The right-angle orientation facilitates efficient spatial arrangement within constrained enclosures while maintaining secure PCB attachment.

Edgeboard Connectors Part Context

This component belongs to the SBCE series of standard card edge connectors manufactured by TE Connectivity AMP Connectors. The series is engineered for general-purpose board-to-board applications requiring reliable signal and power transfer. The specific model integrates a dual-row design to maximize connection density within a standard footprint, serving as a critical interconnect element in various electronic assemblies where space efficiency and electrical integrity are paramount.

Edgeboard Connectors Replacement Considerations

Direct substitutes include other TE Connectivity SBCE series connectors with identical 2x25 positioning and 2.54 mm pitch. Verify compatibility with single-sided or double-sided card edge layouts depending on the target application requirements. Ensure that alternative sources maintain the same gold plating thickness and thermoplastic housing specifications to preserve electrical and mechanical performance.